5536501-3

Heilind Number:	AMP5536501-3
Manufacturer:	TE Connectivity
Manufacturer Number:	5536501-3
Datasheet:	Datasheet
ECAD Model:

Description:

2MM FB,ASY,96,SIG,HDR,SL,4.25

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Specifications

Attribute	Value
Product Category:	Board To Board PCB Connectors Mezzanine & Board Stacking Connectors
Manufacturer:	TE Connectivity
Manufacturer Part Number:	TE Connectivity 5536501-3
Series:	Z-PACK Future Bus+
Amperage:	3 A
Housing Material:	Matte
Number of Rows:	4
Mount Type:	Board Mount
Termination Method:	Through Hole - Press-Fit
Contact Material:	Phosphor Bronze
Contact Plating:	Gold
Overall Width:	16 ;16 mm
Body Orientation:	Straight
Pitch:	.079 in, 2 mm
Voltage:	30 V AC
Contact Type:	Pin
Impedance:	96 Ω
Package Quantity:	12
Contact Amperage:	3 A
Number of Positions:	96
Housing Color:	Natural
Mount Orientation:	Vertical
Insulation Resistance:	4 MΩ
GPL:	473
Mating Entry Location:	Top
Packaging:	Tube
Operating Temperature Range:	-67 - 257 °F
Circuit Application:	Signal
Contact Mating Area Plating:	Gold
Contact Mating Area Plating Thickness:	30 µin, .76 µm
PCB Retention:	With
PCB Contact Termination Area Plating:	Tin
PCB Thickness (Recommended):	2.4 mm, .76 in
Connector Height:	17 mm, .669 in
PCB Retention Type:	Action/Compliant Tail
Sealable:	No
Mating Alignment:	With
Mating Alignment Type:	Guide Pins
GPL Description:	Data and Devices
Connector and Contact Terminate To:	Printed Circuit Board
Product Code:	1832
Number of Signal Positions:	96
Contact Layout:	Matrix
Connector System:	Board to Board
Stackable:	No
ECCN:	EAR99
Board to Board Configuration:	Vertical
PCB Contact Termination Area Plating Finish:	Matte
Connector Width:	16 mm, .622 in
PCB Mount Alignment:	Without
Application Solder Feature:	Board Standoff
Termination Post Tail Length:	.167 in, 4.25 mm
Connector Assembly Type:	PCB Mount Header
PCB Contact Termination Area Plating Thickness:	150 µin, 3.81 µm
Contact Mating Area Length:	.256 in, 6.5 mm
Material Flammability Standard:	UL 94V-0
Part Aliases:	5536501-3
SKU:	AMP5536501-3

Detailed Description

Introducing the Z-PACK Future Bus+ series, a cutting-edge solution for high-speed signal transmission in electronic systems. With a straight body orientation and four rows of pins, this board-mount connector offers exceptional performance and reliability. Featuring a pitch of 2mm and a contact layout of 96 positions, it is ideal for applications requiring precise signal routing. The gold-plated contacts ensure optimal conductivity, while the UL 94V-0 housing material guarantees safety and durability. Operating in a wide temperature range from -67 to 257 °F, this connector is suitable for various environments. Whether used in data and devices or other circuit applications, it provides seamless connectivity on printed circuit boards. With RoHS compliance and a stackable design, it meets international standards for environmental responsibility and versatility. Elevate your electronics with the Z-PACK Future Bus+ connector, the perfect choice for demanding connectivity needs.