| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5536504-3 |
| Series: | Z-PACK Future Bus+ |
| Amperage: | 3 A |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 4 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Press-Fit |
| Contact Material: | Phosphor Bronze |
| Contact Plating: | Gold |
| Overall Width: | 16 ;16 mm |
| Body Orientation: | Straight |
| Pitch: | .079 in, 2 mm |
| Voltage: | 30 V AC |
| Contact Type: | Pin |
| Impedance: | 96 Ω |
| Package Quantity: | 12 |
| Contact Amperage: | 3 A |
| Number of Positions: | 24 |
| Housing Color: | Natural |
| Mount Orientation: | Vertical |
| Insulation Resistance: | 4 MΩ |
| GPL: | 473 |
| Mating Entry Location: | Top |
| Packaging: | Tube |
| Operating Temperature Range: | -67 - 257 °F |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 30 µin, .76 µm |
| PCB Retention: | With |
| PCB Contact Termination Area Plating: | Tin |
| PCB Thickness (Recommended): | 2.4 mm, .76 in |
| Connector Height: | 17 mm, .669 in |
| PCB Retention Type: | Action/Compliant Tail |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarizing Rib |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 1832 |
| Number of Signal Positions: | 96 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Stackable: | No |
| ECCN: | EAR99 |
| Board to Board Configuration: | Vertical |
| Connector Width: | 16 mm, .622 in |
| PCB Mount Alignment: | Without |
| Termination Post Tail Length: | .167 in, 4.25 mm |
| Connector Assembly Type: | PCB Mount Header |
| PCB Contact Termination Area Plating Thickness: | 23.622 µin, .6 µm |
| Contact Mating Area Length: | .256 in, 6.5 mm |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 5536504-3 |
| SKU: | AMP5536504-3 |
5536504-3
Specifications
Detailed Description
Enhance your signal connectivity with the Z-PACK Future Bus+ Board-to-Board Connector. Featuring a straight body orientation and a 2mm pitch, this connector is designed for high-speed data transmission in demanding applications. With a 96Ω impedance and gold contact plating, it ensures reliable performance and signal integrity. The LCP housing material, UL 94V-0 flammability standard, and wide operating temperature range make it suitable for various environments. With 24 positions and 4 rows, it offers ample connectivity options while the through-hole press-fit termination method ensures secure mounting on the PCB. Perfect for vertical board-to-board configurations, this connector is RoHS compliant and ideal for use in data and device applications. Upgrade your connectivity solutions with the Z-PACK Future Bus+ Connector.
Availability
In Stock:
Call
Stock Location:
In Stock
Factory Stock:
Call for Stock
Factory Lead:
Call
Unit Of Measure:
Each
Minimum/Multiple:
1/1
Invalid quantity value
Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |