| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5536507-1 |
| Series: | Z-PACK Future Bus+ |
| Amperage: | 3 A |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 4 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Solder |
| Contact Material: | Phosphor Bronze |
| Contact Plating: | Gold |
| Body Orientation: | Right Angle |
| Pitch: | .079 in, 2 mm |
| Contact Type: | Socket |
| Impedance: | 24 Ω |
| Package Quantity: | 48 |
| Contact Amperage: | 3 A |
| Number of Positions: | 24 |
| Housing Color: | Natural |
| Mount Orientation: | Right Angle |
| Insulation Resistance: | 4 MΩ |
| GPL: | 473 |
| Packaging: | Tube |
| Operating Temperature Range: | -67 - 257 °F |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 30 µin, .76 µm |
| PCB Retention: | With |
| PCB Contact Termination Area Plating: | Tin |
| PCB Thickness (Recommended): | 1.3 mm, .76 in |
| Connector Height: | .357 in, 9.07 mm |
| PCB Retention Type: | Solder Tail |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarizing Rib |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 1830 |
| Number of Signal Positions: | 24 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Stackable: | No |
| ECCN: | EAR99 |
| Board to Board Configuration: | Right Angle |
| PCB Mount Alignment: | With |
| PCB Mount Alignment Type: | Boss |
| Termination Post Tail Length: | .107 in, 2.73 mm |
| Connector Assembly Type: | PCB Mount Receptacle |
| PCB Contact Termination Area Plating Thickness: | 150 µin, 3.81 µm |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 5536507-1 |
| SKU: | AMP5536507-1 |
5536507-1
Specifications
Detailed Description
Introducing the Z-PACK Future Bus+ Board Mount Connector, a high-performance solution for your signal transmission needs. With a low-profile right-angle design and a housing made of durable LCP (Liquid Crystal Polymer), this connector offers reliable connectivity in demanding environments. Featuring 24 gold-plated contacts in a 2mm pitch, it ensures efficient data transfer with an impedance of 24Ω. Ideal for signal applications, it has a contact amperage of 3A and is suitable for PCB mounting with through-hole solder termination. With a natural housing color and a tube packaging, this connector is both visually appealing and easy to handle. RoHS compliant and with an operating temperature range of -67 to 257°F, it meets strict quality and performance standards. Whether for industrial or commercial use, the Z-PACK Future Bus+ is the perfect choice for your board-to-board connectivity needs.

