5536507-1

Heilind Number:AMP5536507-1
Manufacturer:TE Connectivity
Manufacturer Number:5536507-1
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

2MM FB,ASY,24,SIG,REC,SL,2.73

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 5536507-1
Series:Z-PACK Future Bus+
Amperage:3 A
Housing Material:LCP (Liquid Crystal Polymer)
Number of Rows:4
Mount Type:Board Mount
Termination Method:Through Hole - Solder
Contact Material:Phosphor Bronze
Contact Plating:Gold
Body Orientation:Right Angle
Pitch:.079 in, 2 mm
Contact Type:Socket
Impedance:24 Ω
Package Quantity:48
Contact Amperage:3 A
Number of Positions:24
Housing Color:Natural
Mount Orientation:Right Angle
Insulation Resistance:4 MΩ
GPL:473
Packaging:Tube
Operating Temperature Range:-67 - 257 °F
Circuit Application:Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:30 µin, .76 µm
PCB Retention:With
PCB Contact Termination Area Plating:Tin
PCB Thickness (Recommended):1.3 mm, .76 in
Connector Height:.357 in, 9.07 mm
PCB Retention Type:Solder Tail
Sealable:No
Mating Alignment:With
Mating Alignment Type:Polarizing Rib
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:1830
Number of Signal Positions:24
Contact Layout:Matrix
Connector System:Board to Board
Stackable:No
ECCN:EAR99
Board to Board Configuration:Right Angle
PCB Mount Alignment:With
PCB Mount Alignment Type:Boss
Termination Post Tail Length:.107 in, 2.73 mm
Connector Assembly Type:PCB Mount Receptacle
PCB Contact Termination Area Plating Thickness:150 µin, 3.81 µm
Material Flammability Standard:UL 94V-0
Part Aliases:5536507-1
SKU:AMP5536507-1

Detailed Description

Introducing the Z-PACK Future Bus+ Board Mount Connector, a high-performance solution for your signal transmission needs. With a low-profile right-angle design and a housing made of durable LCP (Liquid Crystal Polymer), this connector offers reliable connectivity in demanding environments. Featuring 24 gold-plated contacts in a 2mm pitch, it ensures efficient data transfer with an impedance of 24Ω. Ideal for signal applications, it has a contact amperage of 3A and is suitable for PCB mounting with through-hole solder termination. With a natural housing color and a tube packaging, this connector is both visually appealing and easy to handle. RoHS compliant and with an operating temperature range of -67 to 257°F, it meets strict quality and performance standards. Whether for industrial or commercial use, the Z-PACK Future Bus+ is the perfect choice for your board-to-board connectivity needs.