5536510-2

Heilind Number:AMP5536510-2
Manufacturer:TE Connectivity
Manufacturer Number:5536510-2
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

2MM FB,ASY,048,SIG,REC,SL,3.53

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 5536510-2
Series:Z-PACK Future Bus+
Amperage:3 A
Housing Material:LCP (Liquid Crystal Polymer)
Number of Rows:4
Mount Type:Board Mount
Termination Method:Through Hole - Solder
Contact Material:Phosphor Bronze
Contact Plating:Gold
Body Orientation:Right Angle
Pitch:.079 in, 2 mm
Voltage:30 V AC
Contact Type:Socket
Impedance:48 Ω
Package Quantity:24
Contact Amperage:3 A
Number of Positions:48
Housing Color:Natural
Mount Orientation:Right Angle
Insulation Resistance:4 MΩ
GPL:473
Packaging:Tube
Operating Temperature Range:-67 - 257 °F
Circuit Application:Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:30 µin
PCB Retention:With
PCB Contact Termination Area Plating:Tin
Connector Height:.357 in, 9.07 mm
PCB Retention Type:Solder Tail
Sealable:No
Mating Alignment:With
Mating Alignment Type:Polarizing Rib
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:1830
Number of Signal Positions:48
Contact Layout:Matrix
Connector System:Board to Board
Stackable:No
ECCN:EAR99
Board to Board Configuration:Right Angle
Contact Shape:Dual Beam
PCB Mount Alignment:With
PCB Mount Alignment Type:Boss
Termination Post Tail Length:.139 in, 3.53 mm
Connector Assembly Type:PCB Mount Receptacle
PCB Contact Termination Area Plating Thickness:150 µin, 3.81 µm
Material Flammability Standard:UL 94V-0
Part Aliases:5536510-2
SKU:AMP5536510-2

Detailed Description

Introducing the Z-PACK Future Bus+ Board to Board PCB Connector, a high-performance solution for signal transmission in electronic systems. Featuring a right-angle mount orientation with through-hole solder termination, this connector ensures secure and reliable connections. With 48 signal positions arranged in a matrix layout, it offers ample connectivity options for your PCB assembly. The housing, made of UL 94V-0 rated LCP, guarantees durability and safety. Gold-plated contacts with phosphor bronze construction deliver excellent conductivity and signal integrity, suitable for high-speed data applications. Operating in a wide temperature range from -67 to 257°F, it is ideal for various environments. Designed for ease of assembly, this connector is RoHS compliant and meets international quality standards. Upgrade your system's connectivity with the Z-PACK Future Bus+ Connector.