5536510-4

AMP5536510-4
Heilind Number:AMP5536510-4
Manufacturer:TE Connectivity
Manufacturer Number:5536510-4
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

2MM FB,ASY,192,SIG,REC,SL,3.53

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Specifications

AttributeValue
Product Category:
Board To Board PCB Connectors Mezzanine & Board Stacking Connectors
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 5536510-4
Series:Z-PACK Future Bus+
Amperage:3 A
Housing Material:LCP (Liquid Crystal Polymer)
Number of Rows:4
Mount Type:Board Mount
Termination Method:Through Hole - Solder
Contact Material:Phosphor Bronze
Contact Plating:Gold
Body Orientation:Right Angle
Pitch:.079 in, 2 mm
Voltage:30 V AC
Contact Type:Socket
Impedance:192 Ω
Package Quantity:6
Contact Amperage:3 A
Number of Positions:192
Housing Color:Natural
Mount Orientation:Right Angle
Insulation Resistance:4 MΩ
GPL:473
Packaging:Tube
Operating Temperature Range:-67 - 257 °F
Circuit Application:Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:30 µin, .76 µm
PCB Retention:With
PCB Contact Termination Area Plating:Tin
PCB Thickness (Recommended):1.3 mm, .76 in
Connector Height:.357 in, 9.07 mm
PCB Retention Type:Solder Tail
Sealable:No
Mating Alignment:With
Mating Alignment Type:Polarizing Rib
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:1830
Number of Signal Positions:192
Contact Layout:Matrix
Connector System:Board to Board
Stackable:No
ECCN:EAR99
Board to Board Configuration:Right Angle
Contact Shape:Dual Beam
PCB Mount Alignment:With
PCB Mount Alignment Type:Boss
Termination Post Tail Length:.139 in, 3.53 mm
Connector Assembly Type:PCB Mount Receptacle
PCB Contact Termination Area Plating Thickness:150 µin, 3.81 µm
Material Flammability Standard:UL 94V-0
Part Aliases:5536510-4
SKU:AMP5536510-4

Detailed Description

Introducing the Z-PACK Future Bus+ Board to Board PCB Connector, a high-performance solution for signal transmission in electronic applications. With four rows of sockets and a contact layout optimized for efficient connectivity, this connector offers seamless integration into circuit boards. Featuring a durable LCP housing and gold-plated phosphor bronze contacts, it ensures reliable performance and longevity even in demanding environments. The right-angle mount orientation and through-hole solder termination method allow for easy installation and secure attachment to the PCB. With a voltage rating of 30V AC and an impedance of 192Ω, it is suitable for a wide range of signal transmission tasks. Designed for a temperature range of -67 to 257°F and meeting UL 94V-0 flammability standards, it guarantees safety and stability. Whether for industrial, telecommunications, or consumer electronics applications, the Z-PACK Future Bus+ Connector is the perfect choice for high-speed and high-density connections.