| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5536513-1 |
| Series: | Z-PACK Future Bus+ |
| Amperage: | 3 A |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 4 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Solder |
| Contact Material: | Phosphor Bronze |
| Contact Plating: | Gold |
| Overall Width: | 16 ;16 mm |
| Body Orientation: | Straight |
| Pitch: | .079 in, 2 mm |
| Contact Type: | Pin |
| Impedance: | 24 Ω |
| Package Quantity: | 48 |
| Contact Amperage: | 3 A |
| Number of Positions: | 24 |
| Housing Color: | Natural |
| Mount Orientation: | Vertical |
| Insulation Resistance: | 4 MΩ |
| GPL: | 473 |
| Mating Entry Location: | Top |
| Packaging: | Tube |
| Operating Temperature Range: | -67 - 257 °F |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 30 µin |
| PCB Retention: | Without |
| PCB Contact Termination Area Plating: | Tin |
| Connector Height: | 17 mm, .669 in |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Guide Pins |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 1832 |
| Number of Signal Positions: | 24 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Stackable: | No |
| ECCN: | EAR99 |
| Board to Board Configuration: | Vertical |
| Connector Width: | 16 mm, .622 in |
| PCB Mount Alignment: | Without |
| Application Solder Feature: | Board Standoff |
| Termination Post Tail Length: | .167 in, 4.25 mm |
| Header Type: | Shrouded |
| Connector Assembly Type: | PCB Mount Header |
| PCB Contact Termination Area Plating Thickness: | 150 µin, 3.81 µm |
| Contact Mating Area Length: | .197 in, 5 mm |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 5536513-1 |
| SKU: | AMP5536513-1 |
5536513-1
Specifications
Detailed Description
Introducing the Z-PACK Future Bus+ Board Mount Connector, a high-performance solution for signal transmission in electronic systems. With a straight body orientation and through-hole solder termination method, this connector offers seamless integration onto PCBs. Featuring 24 gold-plated pin contacts, housed in a durable LCP material, it ensures reliable conductivity and longevity. Its 2mm pitch and 4-row design accommodate 24 signal positions, perfect for data and device connections. With a UL 94V-0 flammability standard, operating temperature range of -67 to 257°F, and RoHS compliance, it guarantees safety and environmental responsibility. Ideal for board-to-board configurations, this vertical mount connector, with a natural housing color, is suitable for a wide range of applications in various industries. Elevate your connectivity with the Z-PACK Future Bus+ Connector.
Availability
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Unit Of Measure:
Each
Minimum/Multiple:
1/1
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Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |