| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5536513-4 |
| Series: | Z-PACK Future Bus+ |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 4 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Solder |
| Contact Material: | Phosphor Bronze |
| Pitch: | .079 in, 2 mm |
| Contact Type: | Pin |
| Impedance: | 192 Ω |
| Package Quantity: | 6 |
| Contact Amperage: | 3 A |
| Number of Positions: | 192 |
| Housing Color: | Natural |
| Mount Orientation: | Vertical |
| Insulation Resistance: | 4 MΩ |
| GPL: | 473 |
| Mating Entry Location: | Top |
| Packaging: | Tube |
| Operating Temperature Range: | -67 - 257 °F |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 30 µin, .76 µm |
| PCB Retention: | Without |
| PCB Contact Termination Area Plating: | Tin |
| PCB Thickness (Recommended): | 2.4 mm, .76 in |
| Connector Height: | 17 mm, .669 in |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Guide Pins |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 1832 |
| Number of Signal Positions: | 192 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Stackable: | No |
| ECCN: | EAR99 |
| Board to Board Configuration: | Vertical |
| Connector Width: | 16 mm, .622 in |
| PCB Mount Alignment: | Without |
| Application Solder Feature: | Board Standoff |
| Termination Post Tail Length: | .167 in, 4.25 mm |
| Connector Assembly Type: | PCB Mount Header |
| PCB Contact Termination Area Plating Thickness: | 150 µin, 3.81 µm |
| Contact Mating Area Length: | .197 in, 5 mm |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 5536513-4 |
| SKU: | AMP5536513-4 |
5536513-4
Specifications
Detailed Description
Enhance your connectivity with the Z-PACK Future Bus+ PCB connector, designed for seamless board-to-board integration in high-speed signal applications. Featuring a durable LCP housing in a natural color, this 4-row connector offers 192 pin contact positions with a 2mm pitch, ensuring reliable data transmission. With through-hole solder termination and phosphor bronze contacts plated with gold, it guarantees efficient signal conductivity. Operating in a wide temperature range of -67 to 257°F, it's suitable for diverse environments. Its vertical mount orientation and guide pin alignment facilitate easy installation, while its compact design with a connector height of 17mm allows for space-efficient PCB stacking. RoHS compliant and UL 94V-0 rated for flammability, it meets stringent quality standards for your peace of mind. Elevate your board connectivity with the Z-PACK Future Bus+.
Availability
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Minimum/Multiple:
1/1
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Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |