| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5536623-1 |
| Series: | Z-PACK Future Bus+ |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 4 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Solder |
| Contact Material: | Phosphor Bronze |
| Pitch: | .079 in, 2 mm |
| Voltage: | 30 V AC, 30 V DC |
| Contact Type: | Pin |
| USOC Codes: | Futurebus+ |
| Row Spacing: | .079 in, 2 mm |
| Package Quantity: | 48 |
| Contact Amperage: | 5 A |
| Number of Positions: | 8 |
| Housing Color: | Natural |
| Mount Orientation: | Vertical |
| Insulation Resistance: | 5000 MΩ |
| GPL: | A87 |
| Packaging: | Tube |
| Operating Temperature Range: | -55 - 125 °C, -67 - 257 °F |
| Circuit Application: | Power |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 30 µin, .76 µm |
| PCB Retention: | Without |
| Contact Termination Plating Thickness: | 150 - 350 µin, 3.81 - 8.89 µm |
| PCB Thickness (Recommended): | .063 in, 1.6 mm |
| Connector Height: | 17 mm, .668 in |
| Sealable: | No |
| Mating Alignment Type: | Polarizing Rib |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 1833 |
| Number of Power Positions: | 8 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Contact Termination Plating: | Tin |
| Connector Product Type: | Header |
| Mating Post Length: | .315 in, 8 mm |
| ECCN: | EAR99 |
| Board to Board Configuration: | Right Angle |
| Application Solder Feature: | Board Standoff |
| Termination Post Tail Length: | .135 in, 3.43 mm |
| Contact Retention: | With |
| Glow Wire Rating: | Standard Part - Not Glow Wire |
| Contact Termination Area Plating Finish: | Matte |
| Connector and Housing Type: | Plug |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 5536623-1 |
| SKU: | AMP5536623-1 |
5536623-1
Specifications
Detailed Description
Enhance your power connectivity with the Z-PACK Future Bus+ Board Mount Connector. Featuring a durable LCP housing and Phosphor Bronze contacts, this connector ensures reliable performance in demanding environments. With four rows and eight positions, it offers ample power distribution capabilities. The through-hole solder termination method guarantees secure attachment to the PCB, while the gold plating on the contact mating area ensures optimal conductivity. Operating in a wide temperature range from -55 to 125 °C, this connector is suitable for various applications. Its UL 94V-0 flammability rating and RoHS compliance make it a safe and environmentally friendly choice. Perfect for power circuitry, this connector is a must-have for your electronic projects.

