| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5536627-1 |
| Series: | Z-PACK Future Bus+ |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 4 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Solder |
| Contact Material: | Phosphor Bronze |
| Pitch: | .079 in, 2 mm |
| Voltage: | 30 V AC, 30 V DC |
| Contact Type: | Pin |
| USOC Codes: | Futurebus+ |
| Row Spacing: | .079 in, 2 mm |
| Package Quantity: | 48 |
| Contact Amperage: | 5 A |
| Number of Positions: | 8 |
| Housing Color: | Natural |
| Mount Orientation: | Vertical |
| GPL: | A87 |
| Packaging: | Tube |
| Operating Temperature Range: | -55 - 125 °C, -67 - 257 °F |
| Circuit Application: | Power |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 30 µin, .76 µm |
| PCB Retention: | Without |
| Contact Termination Plating Thickness: | 150 - 350 µin, 3.81 - 8.89 µm |
| PCB Thickness (Recommended): | .063 in, 1.6 mm |
| Connector Height: | 17 mm, .668 in |
| Sealable: | No |
| Mating Alignment Type: | Polarizing Rib |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 1833 |
| Number of Power Positions: | 8 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Contact Termination Plating: | Tin |
| Connector Product Type: | Header |
| ECCN: | EAR99 |
| Board to Board Configuration: | Right Angle |
| Connector Width: | 16 mm, .622 in |
| Application Solder Feature: | Board Standoff |
| Termination Post Tail Length: | .135 in, 3.43 mm |
| Contact Retention: | With |
| Glow Wire Rating: | Standard Part - Not Glow Wire |
| Contact Termination Area Plating Finish: | Matte |
| Connector and Housing Type: | Plug |
| Mating / Unmating Configuration: | Sequencing |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 5536627-1 |
| SKU: | AMP5536627-1 |
5536627-1
Specifications
Detailed Description
Enhance power connectivity with the Z-PACK Future Bus+ Board Mount Connector. Featuring a robust LCP housing and 30 V AC/DC voltage rating, this connector ensures reliable performance in demanding environments. With four rows and eight positions, it offers ample connectivity options for power transmission. The through-hole solder termination method, phosphor bronze contacts, and gold plating guarantee secure and low-resistance connections. Operating between -55°C to 125°C, this connector is suitable for a wide range of applications. Its Futurebus+ interface type, UL 94V-0 flammability standard, and compliance with RoHS regulations make it a versatile and environmentally friendly choice. Designed for vertical mounting, it is ideal for board-to-board configurations in various systems. The connector's Polarizing Rib mating alignment type and sequencing mating/unmating configuration ensure easy and accurate assembly. Whether used in data, devices, or other power applications, this connector offers high performance and durability.

