| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5536677-1 |
| Series: | Z-PACK Future Bus+ |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 4 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Press-Fit |
| Contact Material: | Phosphor Bronze |
| Pitch: | .079 in, 2 mm |
| Voltage: | 30 V AC, 30 V DC |
| Contact Type: | Pin |
| USOC Codes: | Futurebus+ |
| Row Spacing: | .079 in, 2 mm |
| Package Quantity: | 48 |
| Contact Amperage: | 5 A |
| Number of Positions: | 8 |
| Housing Color: | Natural |
| Mount Orientation: | Vertical |
| GPL: | A87 |
| Packaging: | Tube |
| Operating Temperature Range: | -55 - 125 °C, -67 - 257 °F |
| Circuit Application: | Power |
| Contact Mating Area Plating: | Gold Flash |
| Contact Mating Area Plating Thickness: | 20.32 - 33.02 µm, 800 - 1300 µin |
| PCB Retention: | With |
| Contact Termination Plating Thickness: | 150 - 350 µin, 3.81 - 8.89 µm |
| PCB Thickness (Recommended): | .063 in, 1.6 mm |
| Connector Height: | 17 mm, .669 in |
| PCB Retention Type: | Action/Compliant Tail |
| Sealable: | No |
| Mating Alignment Type: | Polarizing Rib |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 1833 |
| Number of Power Positions: | 8 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Contact Termination Plating: | Tin |
| Connector Product Type: | Header |
| Board to Board Configuration: | Right Angle |
| Termination Post Tail Length: | .135 in, 3.43 mm |
| Contact Retention: | With |
| Glow Wire Rating: | Standard Part - Not Glow Wire |
| Contact Termination Area Plating Finish: | Matte |
| Connector and Housing Type: | Plug |
| Mating / Unmating Configuration: | Make First / Break Last, Sequencing |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 5536677-1 |
| SKU: | AMP5536677-1 |
5536677-1
Specifications
Detailed Description
Enhance your power connectivity with the Z-PACK Future Bus+ Board Mount Connector. Featuring a robust housing made of LCP (Liquid Crystal Polymer), this connector offers reliable performance in various applications. With four rows and eight positions, it provides ample connectivity options. The termination method of Through Hole - Press-Fit ensures secure attachment to the PCB. Operating at temperatures ranging from -55 to 125°C (-67 to 257°F), it is suitable for demanding environments. The contact material of Phosphor Bronze with Gold Flash plating guarantees excellent conductivity. Designed for Futurebus+ interface, this connector is ideal for power applications. Compliant with UL 94V-0 flammability standards and RoHS regulations, it meets safety and environmental requirements. With a compact vertical mount orientation and a package quantity of 48, it offers efficient PCB integration. Experience seamless power transmission with this high-quality connector.

