| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5536699-1 |
| Series: | Z-PACK Future Bus+ |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 4 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Press-Fit |
| Contact Material: | Phosphor Bronze |
| Pitch: | .079 in, 2 mm |
| Voltage: | 30 V AC, 30 V DC |
| Contact Type: | Pin |
| USOC Codes: | Futurebus+ |
| Row Spacing: | .079 in, 2 mm |
| Package Quantity: | 48 |
| Contact Amperage: | 5 A |
| Number of Positions: | 8 |
| Housing Color: | Natural |
| Mount Orientation: | Vertical |
| GPL: | A87 |
| Packaging: | Tube |
| Operating Temperature Range: | -55 - 125 °C, -67 - 257 °F |
| Circuit Application: | Power |
| Contact Mating Area Plating: | Hard Gold |
| Contact Mating Area Plating Thickness: | 30 µin, .76 µm |
| PCB Retention: | With |
| Contact Termination Plating Thickness: | 150 - 350 µin, 3.81 - 8.89 µm |
| PCB Thickness (Recommended): | .063 in, 1.6 mm |
| Connector Height: | 17 mm, .668 in |
| PCB Retention Type: | Action/Compliant Tail |
| Sealable: | No |
| Mating Alignment Type: | Polarizing Rib |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 1833 |
| Number of Power Positions: | 8 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Contact Termination Plating: | Tin |
| Connector Product Type: | Header |
| Board to Board Configuration: | Right Angle |
| Termination Post Tail Length: | .135 in, 3.43 mm |
| Contact Retention: | With |
| Glow Wire Rating: | Standard Part - Not Glow Wire |
| Contact Termination Area Plating Finish: | Matte |
| Connector and Housing Type: | Plug |
| Mating / Unmating Configuration: | Make First / Break Last, Sequencing |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 5536699-1 |
| SKU: | AMP5536699-1 |
5536699-1
Specifications
Detailed Description
Enhance power connectivity with the Z-PACK Future Bus+ series, featuring a robust LCP housing material for durability. This board mount connector, with press-fit termination method, offers reliable performance in demanding environments. With four rows and eight power positions, it facilitates efficient power transmission. The phosphor bronze contact material, plated with hard gold, ensures high conductivity and longevity. Operating within a wide temperature range of -55 to 125°C, it is suitable for various applications. Designed for Futurebus+ interface, it guarantees seamless integration. The UL 94V-0 rated housing in natural color adds to its safety features. Perfect for power circuit applications, this connector is RoHS compliant, meeting environmental standards. Upgrade your power systems with this high-quality connector, ideal for board-to-board configurations.

