6-2132790-0

Heilind Number:AMP6-2132790-0
Manufacturer:TE Connectivity
Manufacturer Number:6-2132790-0
Datasheet:3DDrawing
ECAD Model:
3D Model

Description:

SM,HD,ST,120,000,00,SN,Y,10

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 6-2132790-0
Housing Material:Liquid Crystal Polymer
Mount Type:Board Mount
Termination Method:Through Hole - Press-Fit
Contact Material:Copper Alloy
Pitch:.05 in, .12 in, 1.27 mm, .24 in, 3.04 mm, 6.09 mm
Voltage:0 V DC, 250 V AC
Contact Type:Pin
Impedance:100 Ω
Number of Pairs:120
Contact Amperage:1.5 A
Number of Positions:384
Data Rate:16 Gb/s
Housing Color:Black
Mount Orientation:Vertical
Insulation Resistance:1000 MΩ
GPL:G47
Number of Loaded Positions:384
Mating Entry Location:Top
Operating Temperature Range:-67 - 185 °F
Circuit Application:Power & Signal
Contact Mating Area Plating:Gold Flash
Contact Mating Area Plating Thickness:.076 µm, 3 µin
PCB Retention:With
PCB Contact Termination Area Plating:Tin
PCB Thickness (Recommended):.06 mm, .8 in
Connector Height:.385 in, 9.8 mm
Sealable:No
Mating Alignment:With
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:L304
Number of Signal Positions:8
Contact Layout:Staggered
Connector System:Board to Board
Stackable:No
Pairs Per Column:8
Dielectric Withstanding Voltage:750 V AC
Board to Board Configuration:Mezzanine
PCB Contact Termination Area Plating Finish:Matte
Mating Retention:With
PCB Mount Alignment:With
PCB Mount Alignment Type:Post Polarization
Application Solder Feature:Board Standoff
Termination Post Tail Length:.057 in, 1.45 mm
Header Type:Header Only
Connector Assembly Type:PCB Mount Header
Stack Height:10 mm, .394 in
PCB Contact Termination Area Plating Thickness:19.68 - 100 µin, .5 - 2.54 µm
Material Flammability Standard:UL 94V-0
Part Aliases:6-2132790-0
SKU:AMP6-2132790-0

Detailed Description

Elevate your power and signal connections with this high-density, staggered pin header. Designed for board-to-board applications, it features 120 pairs of 1.27mm pitch pins, offering a data rate of 16Gb/s. With a vertical mount orientation and through-hole press-fit termination, it ensures secure and reliable connectivity. The black liquid crystal polymer housing, meeting UL 94V-0 standards, guarantees durability and safety. Gold flash plating on the contact mating area ensures optimal signal transmission, while the copper alloy contact material and 100Ω impedance deliver high performance. Operating in a wide temperature range from -67 to 185°F, this header is suitable for various environments. Its 384 positions, with 8 signal positions per column, provide ample connectivity options. With a compact connector height of 9.8mm, it is ideal for space-constrained applications. RoHS compliance further underscores its quality and environmental responsibility. Experience seamless board-to-board connections with this advanced header.