| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 6376611-1 |
| Series: | Micro Stack |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 2 |
| Mount Type: | Board Mount |
| Termination Method: | Surface Mount |
| Contact Material: | Copper Alloy |
| Pitch: | .023 in, 6 mm |
| Voltage: | 10 V AC |
| Contact Type: | Pin |
| Row Spacing: | .11 in, 2.8 mm |
| Package Quantity: | 45 |
| Contact Amperage: | .5 A |
| Number of Positions: | 80 |
| Housing Color: | Black |
| Mount Orientation: | Vertical |
| GPL: | 523 |
| Mating Entry Location: | Top |
| Packaging: | Tray |
| Operating Temperature Range: | -67 - 185 °F |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .3 µm |
| PCB Retention: | With |
| PCB Contact Termination Area Plating: | Gold Flash |
| PCB Thickness (Recommended): | 1.6 mm |
| Connector Height: | .265 in, 6.75 mm |
| PCB Retention Type: | Solder Peg |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Chamfered Edges |
| GPL Description: | Industrial |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | F377 |
| Connector System: | Board to Board |
| Stackable: | Yes |
| Board to Board Configuration: | Stacking |
| PCB Mount Alignment: | With |
| PCB Mount Alignment Type: | Solder Peg |
| Connector Assembly Type: | PCB Mount Header |
| PCB Contact Termination Area Plating Thickness: | 31.5 µin, .3 µm |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 6376611-1 |
| SKU: | AMP6376611-1 |
6376611-1
Specifications
Detailed Description
Enhance your electronic connections with this Micro Stack HDR Assembly boasting 80 pins for high-density applications. Crafted from durable LCP, it ensures reliable performance in board mount setups. With a contact rating of 0.5 A and 10 V AC, it's ideal for signal transmission. The .6 mm pitch and gold-plated contacts guarantee optimal conductivity, while its compact design, with a height of 6.75 mm, enables vertical orientation for space efficiency. Operating flawlessly in temperatures ranging from -67 to 185 °F, this assembly is suitable for industrial use. Meeting UL 94V-0 standards for flammability, it prioritizes safety. Whether for stacking or board-to-board configurations, its versatile assembly type and solder peg retention offer easy integration onto PCBs. With RoHS compliance and suitability for lead-free soldering processes, it aligns with modern environmental standards. Elevate your connectivity solutions with this robust and efficient Micro Stack HDR Assembly.

