6376611-1

Heilind Number:AMP6376611-1
Manufacturer:TE Connectivity
Manufacturer Number:6376611-1
Datasheet:Drawing
ECAD Model:
3D Model

Description:

MICRO STACK HDR ASSY 80P H=6.75

More >>

Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 6376611-1
Series:Micro Stack
Housing Material:LCP (Liquid Crystal Polymer)
Number of Rows:2
Mount Type:Board Mount
Termination Method:Surface Mount
Contact Material:Copper Alloy
Pitch:.023 in, 6 mm
Voltage:10 V AC
Contact Type:Pin
Row Spacing:.11 in, 2.8 mm
Package Quantity:45
Contact Amperage:.5 A
Number of Positions:80
Housing Color:Black
Mount Orientation:Vertical
GPL:523
Mating Entry Location:Top
Packaging:Tray
Operating Temperature Range:-67 - 185 °F
Circuit Application:Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.3 µm
PCB Retention:With
PCB Contact Termination Area Plating:Gold Flash
PCB Thickness (Recommended):1.6 mm
Connector Height:.265 in, 6.75 mm
PCB Retention Type:Solder Peg
Sealable:No
Mating Alignment:With
Mating Alignment Type:Chamfered Edges
GPL Description:Industrial
Connector and Contact Terminate To:Printed Circuit Board
Product Code:F377
Connector System:Board to Board
Stackable:Yes
Board to Board Configuration:Stacking
PCB Mount Alignment:With
PCB Mount Alignment Type:Solder Peg
Connector Assembly Type:PCB Mount Header
PCB Contact Termination Area Plating Thickness:31.5 µin, .3 µm
Material Flammability Standard:UL 94V-0
Part Aliases:6376611-1
SKU:AMP6376611-1

Detailed Description

Enhance your electronic connections with this Micro Stack HDR Assembly boasting 80 pins for high-density applications. Crafted from durable LCP, it ensures reliable performance in board mount setups. With a contact rating of 0.5 A and 10 V AC, it's ideal for signal transmission. The .6 mm pitch and gold-plated contacts guarantee optimal conductivity, while its compact design, with a height of 6.75 mm, enables vertical orientation for space efficiency. Operating flawlessly in temperatures ranging from -67 to 185 °F, this assembly is suitable for industrial use. Meeting UL 94V-0 standards for flammability, it prioritizes safety. Whether for stacking or board-to-board configurations, its versatile assembly type and solder peg retention offer easy integration onto PCBs. With RoHS compliance and suitability for lead-free soldering processes, it aligns with modern environmental standards. Elevate your connectivity solutions with this robust and efficient Micro Stack HDR Assembly.