| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 7-146277-0 |
| Amperage: | 3 A |
| Housing Material: | Liquid Crystal Polymer |
| Number of Rows: | 1 |
| Termination Method: | Through Hole - Solder |
| Contact Material: | Copper Alloy |
| Pitch: | .1 in, 2.54 mm |
| Contact Type: | Pin |
| Number of Positions: | 20 |
| Mount Orientation: | Vertical |
| Contact Mating Area Plating: | Gold |
| Header Type: | Breakaway |
| Product: | Board-to-Board Headers & Receptacles |
| SKU: | AMP7-146277-0 |
7-146277-0
| Heilind Number: | AMP7-146277-0 |
| Manufacturer: | TE Connectivity |
| Manufacturer Number: | 7-146277-0 |
| ECAD Model: | |
Specifications
Detailed Description
Enhance your PCB connections with this high-performance board-to-board header. With a current rating of 3 A, it ensures reliable power delivery. The housing, made of Liquid Crystal Polymer, offers durability for long-term use. Featuring a single row with 20 gold-plated pin contacts on a 2.54 mm pitch, it guarantees secure and efficient connections. Designed for through-hole solder termination, it allows for easy installation. Its breakaway header type and vertical mount orientation provide versatility in assembly. RoHS compliant, this connector is not only efficient but also environmentally friendly. Elevate your PCB connectivity with this top-quality component.
For Use With
| Product | Part # | Description | Stock |
|---|---|---|---|
 | TE Connectivity 3-87499-8 |  |
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 12/10/2025 | PCN-25-246198 - Plating optimization. Before: (1) Current localized Gold Plating: 0.76 m(30 in) Au plating on contact area. (2) Current localized Gold Plating: 0.38 m(15 in) Au plating on contact area. After: (1) New localized Gold Plating: 0.66 m(26 in) PdNi+ 0.1 m(4 in) Au flash on contact area. (2) New localized Gold Plating : 0.28 m(11 in) PdNi+ 0.1 m(4 in) Au flash on contact area. Note: The Pd-Ni + Au flash plating has been validated for MOD II BKW header connector and test report is attached for reference. | Download | |||
| 03/31/2014 | E-13-019800 - Product Improvement. | Download | |||
