The Board Mount Mezzanine & Board Stacking Connector offers high-performance connectivity for signal transmission in electronic systems. With a compact design featuring dual-beam contact shapes, it ensures reliable and efficient data transfer. Meeting CSA and UL standards, the connector guarantees safety and quality. Its LCP housing material with UL 94V-0 flammability rating provides durability and protection. Suitable for vertical mounting on PCBs, it features surface mount termination and a pitch of .64mm for precise assembly. With 114 positions, including 57 signal and 3 power, it accommodates complex circuit configurations. Operating in a wide temperature range from -67 to 257 °F, it is ideal for diverse applications. The gold or palladium nickel plating on the contact mating area ensures optimal conductivity. With features such as impedance of 50 Ω, data rate of 10 Gb/s, and contact amperage of 11.5 A, this connector is perfect for high-speed and high-power signal transmission. Mating retention, PCB alignment, and locating posts enhance stability during assembly. Suitable for use in various industries, it is a versatile solution for achieving seamless connectivity in electronic devices.
Availability
Immediate Shipment: NA
Stock Location: In Stock
Factory Stock: Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple: 1/1
Pricing
CALL: 800.400.7041
Product Category:
Manufacturer: TE Connectivity
Manufacturer Part Number: 767154-3
Housing Material: LCP (Liquid Crystal Polymer)
Number of Rows: 2
Mount Type: Board Mount
Termination Method: Surface Mount
Contact Material: Copper Alloy
Pitch: .025 in, .64 mm
Voltage: 30 V AC, 3 V DC
Contact Type: Socket
Row Spacing: .228 in, 5.79 mm
Impedance: 50 Ω
Package Quantity: 10
Contact Amperage: 11.5 A
Number of Positions: 114
Data Rate: 10 Gb/s
Housing Color: Black
Mount Orientation: Vertical
Insulation Resistance: 2 MΩ
GPL: 481
Mating Entry Location: Bottom
Packaging: Box & Tube, Tube
Operating Temperature Range: -67 - 257 °F
Circuit Application: Signal
Contact Mating Area Plating: Gold or Palladium Nickel or Performance Based
Contact Mating Area Plating Thickness: .12 µm, 5 µin
PCB Retention: With
PCB Contact Termination Area Plating: Tin-Lead
PCB Thickness (Recommended): 1.57 mm, .8 in
Connector Height: 15.011 mm, .591 in
Sealable: No
Ground Component Type: Ground Bus
Mating Alignment: Without
GPL Description: Data and Devices
Connector and Contact Terminate To: Printed Circuit Board
Product Code: E001
Number of Columns: 57
Number of Power Positions: 3
Number of Signal Positions: 114
Contact Layout: Inline
Connector Length: 2 in, 50.8 mm
Connector System: Board to Board
CSA Agency Certification: 1195944
UL Agency Certification: E28476
Stackable: No
ECCN: EAR99
Board to Board Configuration: Mezzanine
Contact Shape: Dual Beam
Connector Width: .315 in, 8 mm
Mating Retention: With
PCB Mount Alignment: With
PCB Mount Alignment Type: Locating Posts
Differential Signaling: Yes
Header Type: Header Only
Connector Assembly Type: PCB Mount Receptacle
Stack Height: 15.62 mm, 18 mm, 1.255 in, 20 mm, 21.6 mm, 27.8 mm, 27 mm, 29 mm, 31.9 mm
PCB Contact Termination Area Plating Thickness: 150 - 250 µin
Standards Met: CSA
Material Flammability Standard: UL 94V-0
Part Aliases: 767154-3
Replacement Part: 5767154-3
SKU: AMP767154-3

Environmental Initiative Details

Environmental Initiative: RoHS
Compliant: Unknown
Date of this Information: Unknown
Notes: