| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 826629-1 |
| Series: | AMPMODU Headers |
| Housing Material: | Polybutylene Terephthalate - GF |
| Number of Rows: | 1 |
| Termination Method: | Through Hole - Solder |
| Contact Material: | CuZn |
| Pitch: | .1 in, 2.54 mm |
| Contact Type: | Pin |
| Strain Relief: | No Strain Relief |
| Row Spacing: | .1 in, 2.54 mm |
| Package Quantity: | 3000 |
| Number of Positions: | 1 |
| Housing Color: | Green |
| Mount Orientation: | Vertical |
| GPL: | 015 |
| Profile: | Standard |
| Packaging: | Box |
| Contact Mating Area Plating: | Gold Flash |
| Contact Mating Area Plating Thickness: | 30 µin |
| Panel Mount: | Without |
| PCB Retention: | Without |
| Contact Underplating Material: | Nickel |
| PCB Contact Termination Area Plating: | Tin |
| Sealable: | No |
| Mating Alignment: | Without |
| GPL Description: | Industrial |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 5233 |
| Post Size: | .025 in, .64 mm |
| Mating Post Length: | .264 in, 6.7 mm |
| ECCN: | EAR99 |
| Connector Contact Load Condition: | Fully Loaded |
| Contact Shape: | Square |
| Application Solder Feature: | Board Standoff |
| Termination Post Tail Length: | .126 in, 3.2 mm |
| Header Type: | Breakaway |
| Connector Assembly Type: | PCB Mount Header |
| High Temperature Housing: | No |
| Temperature Rating: | Standard |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 826629-1 |
| SKU: | AMP826629-1 |
826629-1
Specifications
Detailed Description
Easily connect components on your printed circuit board with this single-row AMPMODU II PIN HDR.1X01P. Featuring a durable Polybutylene Terephthalate housing in a vibrant green color, this header is designed for vertical mounting without the need for strain relief. With a 2.54mm pitch and gold flash plating on the contact mating area, it ensures reliable conductivity. Suitable for industrial applications, it is compatible with lead-free solder processes up to 265°C, making it a versatile and dependable choice for your PCB assembly needs.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 07/10/2014 | E-14-002835 - Product Improvement. Streamlining of contact base material. Plating process transfer to TE Bydgoszcz. To maintain a competitive position in the market place.Product tested and validated see test report 502-19945. | Download | |||
| 10/29/2012 | P-12-007877 - Manufacturing location change. | Download | |||
Availability
In Stock:
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Stock Location:
In Stock
Factory Stock:
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Factory Lead:
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Unit Of Measure:
Each
Minimum/Multiple:
1/1
Invalid quantity value
Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |