86774-1

Enhance connectivity with our FFC to round wire splice, designed for seamless termination using Insulation Displacement Crimp (IDC) technology. This essential component features a 2.54mm (.1 in) pitch, ideal for splicing applications. With a contact type specifically suited for flat cable to round cable connections, it ensures reliable performance. Operating efficiently in a wide temperature range from -65 to 105 °C (-85 to 221 °F), it guarantees durability in diverse environments. The gold-plated contact mating area, with a thickness of 15 µin, offers superior conductivity, while the nickel underplating enhances longevity. Reflow solder capable to 260°C, it facilitates lead-free solder processes for eco-friendly operations. Suitable for wire sizes ranging from 22 to 26 AWG (.12 to .4 mm²) and accepting wire insulation diameters from .89 to 1.52 mm (.035 to .06 in), it provides versatility in connectivity solutions. RoHS compliant and meticulously crafted for quality assurance, this FFC to round wire splice is an essential component in various electronic applications.