966754-3

Heilind Number:AMP966754-3
Manufacturer:TE Connectivity
Manufacturer Number:966754-3
Datasheet:Drawing
ECAD Model:
3D Model

Description:

MOD2 ST-LEI SMD2X3P

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 966754-3
Series:AMPMODU Headers
Housing Material:PCT GF
Number of Rows:2
Termination Method:Surface Mount
Contact Material:CuZn, Phosphor Bronze
Pitch:.1 in, 2.54 mm
Contact Type:Pin
Strain Relief:No Strain Relief
Row Spacing:.1 in, 2.54 mm
Package Quantity:69
Contact Amperage:5 A
Number of Positions:6
Mount Orientation:Vertical
GPL:013
Packaging:Box, Box & Tube
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:30 µin
Panel Mount:Without
PCB Retention:Without
Contact Underplating Material:Nickel
PCB Contact Termination Area Plating:Tin
Mating Alignment:Without
GPL Description:Industrial
Connector and Contact Terminate To:Printed Circuit Board
Product Code:1058
Post Size:.025 in, .64 mm
Mating Post Length:.378 in, 9.6 mm
ECCN:EAR99
Connector Contact Load Condition:Fully Loaded
Contact Shape:Square
Header Type:Breakaway
Connector Assembly Type:PCB Mount Header
High Temperature Housing:No
Temperature Rating:Standard
Part Aliases:966754-3
SKU:AMP966754-3

Detailed Description

Upgrade your PCB assembly with the innovative MOD2 ST-LEI SMD2X3P series AMPMODU Headers. Featuring a double-row design with 6 positions and a 2.54mm pitch, these headers offer seamless surface mount termination. Crafted with durable PCT GF housing and high-quality Phosphor Bronze contacts plated with gold, they ensure reliable connectivity in industrial applications. With a contact rating of 5A and a mating post length of 9.6mm, they are suitable for a wide range of electronic devices. RoHS compliant and designed for lead-free solder processes, these headers guarantee both performance and environmental responsibility. Upgrade your assembly with these AMPMODU Headers and experience enhanced reliability in your PCB connections.