| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Amphenol FCI Berg |
| Manufacturer Part Number: | Amphenol FCI Berg 10114587-004LF |
| Color: | Black |
| Pitch: | 1.27 mm, 2.54 mm |
| Gender: | Female |
| Mount Angle: | Straight |
| Mating Cycles: | 200 cycle |
| Card Thickness: | 1.57 mm |
| Voltage Rating: | 17 V, 548 V |
| Contact Plating: | Metal |
| Contact Material: | Copper Alloy |
| Housing Material: | High Temperature Plastic |
| Number of Contacts: | 24, 36 |
| Termination Method: | Press-Fit |
| Maximum Operating Temperature: | 105 °C |
| Minimum Operating Temperature: | -55 °C |
| Series: | HPCE® |
| SKU: | BRG10114587-004LF |
10114587-004LF
| Heilind Number: | BRG10114587-004LF |
| Manufacturer: | Amphenol FCI Berg |
| Manufacturer Number: | 10114587-004LF |
| ECAD Model: |
Specifications
Detailed Description
Introducing the OEM ITEM 517-52VF-HIGH POWER CARD, a high-performance connector designed for demanding applications. Featuring a sleek black housing made of durable high temperature plastic, this connector ensures reliable performance in extreme environments. With 24 and 36 contacts available for seamless connectivity, it offers press-fit termination for easy installation. Crafted with copper alloy contacts and metal plating, it guarantees excellent conductivity and longevity. With a wide operating temperature range of -55°C to 105°C, it is suitable for a variety of industrial settings. RoHS compliant and with a voltage rating of 17V to 548V, it meets stringent safety standards. Perfect for board-to-board or card edge connections, this HPCE® series connector is a must-have for any high-power application.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 04/15/2021 | PCN21028 - Material Change. Adding an alternative Resin. A recent disruption to the supply of resin has resulted in materials shortages. An alternative resin is being added to improve security of supply. | Download | |||
| 03/01/2018 | PCN18012 - Packaging Change. 1. Increase the packaging slot quantities of tray 2. Change the cover type 3. Change SPQ and MOQ | Download | |||
| 08/30/2013 | PCN13050 - Documentation Change. | Download | |||

