| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Amphenol FCI Berg |
| Manufacturer Part Number: | Amphenol FCI Berg 10119449-004LF |
| Color: | Black |
| Series: | HPCE® |
| Gender: | Female |
| Housing Material: | High Temperature Plastic |
| Number of Contacts: | 24, 8 |
| Termination Method: | Press-Fit |
| Contact Material: | Copper Alloy |
| Contact Plating: | GXT |
| Maximum Operating Temperature: | 105 °C |
| Minimum Operating Temperature: | -55 °C |
| Pitch: | 1.27 mm, 2.54 mm |
| Mount Angle: | Straight |
| Mating Cycles: | 200 cycle |
| Voltage Rating: | 17 V, 548 V |
| Card Thickness: | 1.57 mm |
| SKU: | BRG10119449-004LF |
10119449-004LF
| Heilind Number: | BRG10119449-004LF |
| Manufacturer: | Amphenol FCI Berg |
| Manufacturer Number: | 10119449-004LF |
| ECAD Model: |
Specifications
Detailed Description
Introducing the HPCE® Series Board To Board PCB Connector, SKU 10119449-004LF. This high-performance connector, designed with female gender specification, features a sleek black housing made of durable high temperature plastic. With 8 and 24 contacts available, it offers flexibility in connectivity. The press-fit termination method ensures secure and reliable connections, while the copper alloy contacts with GXT plating guarantee optimal conductivity. Operating efficiently in temperatures ranging from -55 °C to 105 °C, it is suitable for a wide range of applications. The 2.54 mm and 1.27 mm pitch options, along with straight mount angle, facilitate easy installation. With a mating cycle of 200 cycles and voltage ratings of 17V and 548V, this connector is both durable and efficient. Perfect for use in hi-rel environments, it is ideal for demanding PCB connectivity needs. Trust in the 10119449004LF for seamless and high-quality board-to-board connections.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 04/15/2021 | PCN21028 - Material Change. Adding an alternative Resin. A recent disruption to the supply of resin has resulted in materials shortages. An alternative resin is being added to improve security of supply. | Download | |||
| 09/11/2019 | PCN19045 - Packaging Change. Increase the packaging slot quantities from 6 slots to 9 slots in a tray,but there is no change for tray size. Change Cover style from 1 cover/tray to 1 cover/10 loaded trays. Change SPQ and MOQ. | Download | |||
| 07/30/2015 | PCN15068 - Process Change. Remove some printing information on the HPCE/PEC products due to space constraints. | Download | |||
| 08/30/2013 | PCN13050 - Documentation Change. | Download | |||

