| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Amphenol FCI Berg |
| Manufacturer Part Number: | Amphenol FCI Berg 10121506-160012DLF |
| Color: | Black |
| Pitch: | 1.27 mm, 2.54 mm |
| Gender: | Female |
| Mount Angle: | Straight |
| Mating Cycles: | 200 cycle |
| Card Thickness: | 1.57 mm |
| Voltage Rating: | 17 V, 548 V |
| Contact Plating: | GXT |
| Contact Material: | Copper Alloy |
| Housing Material: | High Temperature Plastic |
| Number of Contacts: | 12, 16 |
| Termination Method: | Press-Fit |
| Maximum Operating Temperature: | 105 °C |
| Minimum Operating Temperature: | -55 °C |
| Series: | HPCE® |
| SKU: | BRG10121506-160012DLF |
10121506-160012DLF
| Heilind Number: | BRG10121506-160012DLF |
| Manufacturer: | Amphenol FCI Berg |
| Manufacturer Number: | 10121506-160012DLF |
| ECAD Model: |
Specifications
Detailed Description
Introducing the HPCE® Female Board-to-Board PCB Connector, 10121506-160012DLF. Designed for high temperature environments, this connector features a durable housing made from High Temperature Plastic. With 12 and 16 copper alloy contacts plated with GXT for optimal conductivity, it ensures reliable performance even in extreme conditions. The press-fit termination method guarantees secure and stable connections. Operating between -55°C and 105°C, and with a voltage rating of 17V to 548V, it is suitable for a wide range of applications. The straight mount angle and 2.54mm/1.27mm pitch allow for easy installation on PCBs with 1.57mm card thickness. With a mating cycle of 200, this connector offers long-lasting durability. Perfect for demanding environments, it is a crucial component for any electronic system.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 04/15/2021 | PCN21028 - Material Change. Adding an alternative Resin. A recent disruption to the supply of resin has resulted in materials shortages. An alternative resin is being added to improve security of supply. | Download | |||
| 09/11/2019 | PCN19045 - Packaging Change. Increase the packaging slot quantities from 6 slots to 9 slots in a tray,but there is no change for tray size. Change Cover style from 1 cover/tray to 1 cover/10 loaded trays. Change SPQ and MOQ. | Download | |||
| 07/30/2015 | PCN15068 - Process Change. Remove some printing information on the HPCE/PEC products due to space constraints. | Download | |||
| 08/30/2013 | PCN13050 - Documentation Change. | Download | |||

