| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Amphenol FCI Berg |
| Manufacturer Part Number: | Amphenol FCI Berg 61083-101409LF |
| Color: | Natural |
| Pitch: | 0.8 mm |
| Gender: | Male |
| Mount Angle: | Straight |
| Mating Cycles: | 100 cycle |
| Current Rating: | 0.8 A |
| Number of Rows: | 2 |
| Voltage Rating: | 100 VAC |
| Contact Plating: | Gold |
| Contact Material: | Brass |
| Housing Material: | Glass-Filled Liquid Crystal Polymer |
| Number of Contacts: | 100 |
| Flammability Rating: | UL 94V-0 |
| Maximum Operating Temperature: | 125 °C |
| Minimum Operating Temperature: | -40 °C |
| Series: | BergStak® |
| SKU: | BRG61083-101409LF |
61083-101409LF
| Heilind Number: | BRG61083-101409LF |
| Manufacturer: | Amphenol FCI Berg |
| Manufacturer Number: | 61083-101409LF |
| ECAD Model: |
Specifications
Detailed Description
Introducing the BergStak® 61083-101409LF, a high-performance board-to-board connector designed for seamless and reliable interconnectivity in electronic systems. Crafted with precision and durability in mind, this connector features a natural color housing made of glass-filled liquid crystal polymer, ensuring robust performance in a wide range of operating conditions. With 100 contacts in a dual-row configuration, each contact is meticulously crafted from brass and plated with gold for optimal conductivity. Operating at temperatures ranging from -40°C to 125°C, this connector is suitable for use in diverse environments. With a pitch of 0.8mm and a straight mount angle, it offers easy and secure installation on PCBs. Rated for 100 mating cycles and compliant with RoHS regulations, the 61083-101409LF guarantees long-term reliability and environmental sustainability. Perfect for applications in aerospace, defense, and industrial sectors, this connector is a trusted solution for your connectivity needs.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 04/15/2016 | PCN16002 - Packaging Change. 1. Change the existing material of carrier tape from Polystyrene clear (PS) to Polythylene terephthalate clear (PET). 2. Change existing carrier tape design to prevent deformation of solder tail of terminals. | Download | |||

