| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Amphenol FCI Berg |
| Manufacturer Part Number: | Amphenol FCI Berg 61083-164400LF |
| Color: | Natural |
| Series: | BergStak® |
| Gender: | Male |
| Housing Material: | Glass-Filled Liquid Crystal Polymer |
| Number of Contacts: | 160 |
| Number of Rows: | 2 |
| Contact Material: | Brass |
| Contact Plating: | Gold |
| Maximum Operating Temperature: | 125 °C |
| Minimum Operating Temperature: | -40 °C |
| Pitch: | 0.8 mm |
| Mount Angle: | Straight |
| Mating Cycles: | 100 cycle |
| Flammability Rating: | UL 94V-0 |
| Current Rating: | 0.8 A |
| Voltage Rating: | 100 VAC |
| SKU: | BRG61083-164400LF |
61083-164400LF
| Heilind Number: | BRG61083-164400LF |
| Manufacturer: | Amphenol FCI Berg |
| Manufacturer Number: | 61083-164400LF |
| ECAD Model: |
Specifications
Detailed Description
Introducing the 61083-164400LF, a high-performance BergStak® board-to-board connector designed for male applications. With a rugged housing made of glass-filled liquid crystal polymer, this connector ensures durability in even the harshest environments. Featuring 160 contacts in a 2-row configuration, each contact is precision-crafted from brass and plated with gold for optimal signal transmission. Operating seamlessly in temperatures ranging from -40°C to 125°C, it guarantees reliable performance in a wide range of conditions. With a pitch of 0.8mm and straight mount angle, it offers easy and secure PCB connectivity. This connector is RoHS compliant and meets UL 94V-0 flammability rating standards, making it safe for use in various electronic devices. With a current rating of 0.8A and voltage rating of 100VAC, it is suitable for high-speed data transmission and power applications. Perfect for demanding board stacking and mezzanine connector needs, the 61083-164400LF is the ideal choice for your next project.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 04/15/2016 | PCN16002 - Packaging Change. 1. Change the existing material of carrier tape from Polystyrene clear (PS) to Polythylene terephthalate clear (PET). 2. Change existing carrier tape design to prevent deformation of solder tail of terminals. | Download | |||

