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IP67 D-SUB Standard/ High Density

Modern data and control systems must perform reliably even in harsh outdoor or industrial environments. Exposure to extreme temperatures, moisture, and chemicals places high demands on connectors, which are critical for maintaining uninterrupted power and signal transmission. CONEC’s IP67 D-SUB Standard and High-Density series provide robust solutions with a wide range of contact configurations, mounting styles, and termination options, along with three distinct housing choices—Solid Body, SlimCon, and Standard Housing—to meet application-specific needs.

The IP67 D-SUB Solid Body connectors feature a durable, one-piece zinc die-cast housing with a nickel-plated finish, offering maximum protection of the contact area under heavy mechanical stress. Options include solder cup, straight and angled solder pin terminations, plus high-density and mixed-layout designs.

For space-constrained applications, the IP67 D-SUB SlimCon series delivers compact dimensions in a rugged one-piece zinc die-cast body. Designed with standard D-SUB housing dimensions, SlimCon enables a direct 1:1 upgrade from IP20 systems to IP67 protection without modifying panel cutouts. Compared to traditional IP67 connectors with extended sealing frames, SlimCon reduces the required installation area by nearly 50%, optimizing space without sacrificing performance.