Laird Performance Materials
Laird Performance Materials is a global technology company focused on providing systems, components and solutions that enable connectivity in mission critical systems through wireless applications and antenna systems, and that protect electronics from electromagnetic interference and heat.
Their products are supplied to all sectors of the electronics industry including automotive, rail, industrial, medical, telecom/computing, and the mobile device markets.
Laird is helping solve difficult design challenges to better ensure the reliable performance of electronic devices and systems and enable manufacturers to achieve time-to-market objectives. See their capabilities guid here.
Laird Performance Materials products play a critical role in Industrial & Robotics applications by ensuring power stability, electromagnetic compatibility, and signal integrity in electrically noisy and high-performance environments. Their multilayer ferrite chip power inductors are used in motor drives, control systems, and power supplies to filter EMI, manage current ripple, and maintain clean power delivery to sensitive components. Meanwhile, Laird’s two-piece board level shields protect high-speed processors, communication modules, and sensor interfaces from external interference, enabling reliable operation of robotic systems, machine vision units, and wireless communication modules in factory automation and robotics platforms. Together, these components help maintain performance, reduce downtime, and support compliance with strict EMC standards in demanding industrial settings.
Electromagnetic Interference (EMI) and Radio Frequency Interference (RFI)- Industrial and robotic systems often operate in environments with heavy electrical noise from motors, drives, and switching power supplies.
Power Integrity and Noise Suppression- High-speed switching and complex control systems generate voltage spikes and noise.
Signal Integrity in High-Speed and Wireless Communication- Robotics often relies on real-time data transfer through wired and wireless networks.
Thermal Management in Compact, High-Power Systems- Robotic and industrial electronics are becoming more compact and thermally dense.
Mechanical Reliability and Vibration Resistance- Industrial robots operate in dynamic environments with frequent movement and vibration.
Design Flexibility and Serviceability
- Multilayer Ferrite Chip Power Inductors – For Power integrity, EMI suppression
- Two-Piece Board Level Shields – EMI/RFI protection, signal integrity, design flexibility
- Thermal Interface Materials (TIMs) – Heat management in high-power, compact devices
- RF Absorbers and EMI Absorptive Materials – High-frequency EMI and signal crosstalk
- Conductive Elastomers and Gaskets – EMI shielding with mechanical durability
- Fingerstock and Shielding Tapes – Customizable EMI protection and easy integration
Data generated from enterprises, social media, and interactive gaming, along with major trends like the expansion of 5G and its emerging applications, continues to fuel the rapid growth of data centers. Data centers are not only increasing in quantity but also in terms of data transmission rates, operating frequencies, and higher power densities. Laird’s EMI and thermal management solutions empower design engineers to tackle issues ranging from signal interference in routers to escalating heat loads, as these challenges grow more intricate and interconnected.
- Electromagnetic Interference (EMI) Mitigation
- Thermal Management
- Signal Integrity & Reliability
- Miniaturization & Component Density
- Environmental & Compliance Requirements
- Scalability & Future-Proofing
- Rack Components – Server/Switch/Router
Gap Fillers, Dispensable Gap Fillers, Phase Change, CoolZorb, ISE (Integrated Solutions Engineered), Inductors for Power & Signal Lines, FOF Gaskets (Fabric-over-Foam), Fingerstock Metal Gaskets, Microwave Absorbers, MaxAir Vent Panel - Pluggable / Connector
5G Accelerator Cards, SSD, NIC, Optical Transceiver, Backplane
Featured Product Solutions
Laird offers wide range inductance of multilayer power inductors. They are robust, small-sized structures. Low-loss magnetic material allows parts to perform at low DCR with high reliability under DC loading.
APPLICATIONS 
- Mainly for DC-DC converters and power modules
- Suitable for DVD , DSC , PND , PC , NB
- Cellular phones
FEATURES
- Small size
- The monolithic construction performs high reliability
- Allow for higher mounting density
- Low DC resistance
BLS Solutions
Two-piece shields offer users the flexibility to inspect or repair shielded components without having to risk board damage by removing the entire shield. Covers snap on and off, making repairs quicker and easier. Board rework is reduced. There are no tooling costs associated with standard off-the-shelf designs
Features and Benefits:
- Standard offering available
- Surface Mount
- Rigid Corner
- Removable pick bridge
- Tight coplanarity tolerances
- Different metal substrate options
- Different plating options
- Different cover to frame locking options
- Vented and unvented options
- Tape and Reel packaging
- No tooling costs with standard off-the-shelf designs
- Shielding Effectiveness typcially 40 dB @1 GHz
Resources:
EMI Noise Suppresion Absorber
Eccosorb™ RF-LB is a silicone based elastomeric absorber with an improved low frequency filler system. The proprietary filler system provides higher permeability than standard Eccosorb™ magnetic sheet materials, with a higher temperature limit than standard near field noise suppression absorber products. Eccosorb™ RF-LB is used to suppress unwanted energy coupling and resonant or surface currents that cause EMI issues.
Features & Benefits 
- High Permeability
- Excellent EMI suppression for lower frequency applications
- High Temp near field noise suppression suitable for automotive applications
- Suitable for suppression of cavity resonances and surface currents
- Flexible
- Dust free
- UL94 H-B
- REACH and ROHS compliant
Gap fillers are used widely to help resolve heat mitigation issues in electronic devices. Some of the industries and products utilizing gap fillers are automotive ADAS, automotive lighting, infotainment and powertrain, drones/satellites, gaming systems, instrumentation, notebooks/tablets, portable devices, routers, smart home devices, test and measurement equipment, and wireless infrastructure systems.
Tflex™ series includes a broad range of options tailored for different performance needs—ranging from basic silicone-based pads to high-conductivity silicone-free variants.
Silicone-Based Gap Fillers: Tflex 300/300TG, Tflex 600, Tflex 700, Tflex 50000,
High-Deflection Series- HD300/HD300TG, HD7.5, HD700, HD80000, HD90000
Silicone-Free Gap Fillers: SF4, SF10, SF16, SF600, SF7, SF800
Specialty Options- Tflex HP34, Tflex B200, Tflex RB300
| Need | Recommended Series |
|---|
| Basic thermal bridging | Tflex 300 / 600 |
| Higher conductivity (soft pads) | Tflex 700, HD700, HD300 (higher deflection) |
| Very high conductivity (rigid) | SF16, HP34 |
| Silicone-sensitive environments | Silicone-free SF-series |
| Minimal mechanical stress | HD-series, RB300 |
Featured Digital Datasheets
Check out Laird’s latest products displayed in our new digital datasheet format and learn even more about them.