| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | EDAC |
| Manufacturer Part Number: | EDAC 307-010-547-158 |
| Color: | Green |
| Amperage: | 5 A |
| Housing Material: | UL 94V-0 Thermoplastic Polyester |
| Number of Rows: | 1 |
| Contact Material: | Copper Alloy |
| Pitch: | .156 in |
| Row Spacing: | .2 in |
| Number of Positions: | 10 |
| Mount Orientation: | Straight |
| Operating Temperature Range: | -40 - 105 °C |
| SKU: | EDA307-010-547-158 |
307-010-547-158
| Heilind Number: | EDA307-010-547-158 |
| Manufacturer: | EDAC |
| Manufacturer Number: | 307-010-547-158 |
| ECAD Model: | |
Description:
307 Series (.156" (3.96mm) contact spacing) Card Edge Connector with 10 Wire Wrap contacts with gold plating on the contact area. The tails are .046" x .013" (1.17mm x 0.33mm) thick and .520" (13.21mm) long in a Single Row formation, reading one side of the daughter board. The Insulator is Green in color with .468" (11.89mm) Offset Card Guides.
More >>Specifications
Detailed Description
Enhance connectivity within your electronic devices with our Card Edge Connector, a vital component for seamless PCB integration. Boasting a vibrant green hue, it not only ensures efficient power transmission but also adds a touch of color to your assembly. Crafted from UL 94V-0 Thermoplastic Polyester, it guarantees durability and fire resistance, ideal for industrial and commercial applications. With a single row design and a contact material of Copper Alloy, it offers reliable performance in high-speed data transfer. Featuring a pitch of .156 inches and a row spacing of .2 inches, it allows for precise and secure connections. With ten positions available, it accommodates multiple input/output requirements, making it versatile for various circuit designs. Its straight mount orientation and wide operating temperature range of -40 to 105°C further enhance its usability in diverse environments. Trust in this essential connector for seamless and dependable board-to-board connections in your electronic projects.
