| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | EDAC |
| Manufacturer Part Number: | EDAC 307-013-557-103 |
| Color: | Green |
| Amperage: | 5 A |
| Housing Material: | UL 94V-0 Thermoplastic Polyester |
| Number of Rows: | 1 |
| Contact Material: | Copper Alloy |
| Pitch: | .156 in |
| Row Spacing: | .2 in |
| Number of Positions: | 13 |
| Mount Orientation: | Right Angle |
| Operating Temperature Range: | -40 - 105 °C |
| SKU: | EDA307-013-557-103 |
307-013-557-103
| Heilind Number: | EDA307-013-557-103 |
| Manufacturer: | EDAC |
| Manufacturer Number: | 307-013-557-103 |
| ECAD Model: | |
Description:
307 Series (.156" (3.96mm) contact spacing) Card Edge Connector with 13 90 Deg' Tail Bend contacts with gold plating on the contact area. (Contact Code 541 bent from 'bottom side' of insulator down with .045" (1.14mm) standoff) in a Single Row formation, reading both sides of the daughter board. The Insulator is Green in color with ∅.116" (∅2.95mm) I.D. Floating Eyelets.
More >>Specifications
Detailed Description
Enhance your PCB connectivity with our Card Edge Connector. Designed for seamless integration, this connector features a single row layout with 13 positions, effectively facilitating data transmission. Crafted from durable UL 94V-0 Thermoplastic Polyester, it ensures reliable performance even in challenging environments. The contact material, copper alloy, guarantees excellent conductivity while the green housing adds a touch of color to your setup. With a pitch of .156 inches and row spacing of .2 inches, precise alignment is effortlessly achieved. Whether it's for industrial or commercial use, this connector, operating smoothly in temperatures ranging from -40 to 105 °C, is a versatile solution for your connectivity needs. Its right-angle mount orientation offers flexibility in installation, making it suitable for a wide range of applications. Upgrade your PCB connections with this high-quality connector, a vital component in ensuring seamless communication within your systems.
