| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | EDAC |
| Manufacturer Part Number: | EDAC 307-018-453-112 |
| Color: | Green |
| Amperage: | 5 A |
| Housing Material: | UL 94V-0 Thermoplastic Polyester |
| Number of Rows: | 1 |
| Contact Material: | Copper Alloy |
| Pitch: | .156 in |
| Row Spacing: | .2 in |
| Number of Positions: | 18 |
| Mount Orientation: | Right Angle |
| Operating Temperature Range: | -40 - 105 °C |
| SKU: | EDA307-018-453-112 |
307-018-453-112
| Heilind Number: | EDA307-018-453-112 |
| Manufacturer: | EDAC |
| Manufacturer Number: | 307-018-453-112 |
| ECAD Model: | |
Description:
307 Series (.156" (3.96mm) contact spacing) Card Edge Connector with 18 90 Deg' Tail Bend contacts with tin plating all over. (Contact Code 521 bent from 'bottom side' of insulator down with .045" (1.14mm) standoff) in a Single Row formation, reading both sides of the daughter board. The Insulator is Green in color with ∅.128" (∅3.25mm) Side Mounting Holes.
More >>Specifications
Detailed Description
Enhance your PCB connectivity with our Card Edge Connector, designed for seamless integration in electronic devices. Boasting a vibrant green hue, this connector not only adds a pop of color but also ensures easy identification on circuit boards. With a high amperage rating of 5A, it guarantees reliable power transmission. Crafted from UL 94V-0 thermoplastic polyester, its housing material offers exceptional durability and flame resistance. Featuring a single row design with 18 positions, it enables efficient data transfer within your systems. The contact material, made of copper alloy, ensures optimal conductivity. With a pitch of .156 inches and a row spacing of .2 inches, it allows for precise alignment on your PCB. Its right-angle mount orientation offers flexibility in installation, while the wide operating temperature range of -40 to 105 °C ensures performance in various environments. Trust in this connector for secure and efficient board-to-board connections in your electronic projects.
