| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | EDAC |
| Manufacturer Part Number: | EDAC 337-018-500-603 |
| Color: | Green |
| Amperage: | 3 A |
| Housing Material: | UL 94V-0 Thermoplastic Polyester |
| Number of Rows: | 1 |
| Contact Material: | Copper Alloy |
| Pitch: | .156 in |
| Row Spacing: | .2 in |
| Number of Positions: | 18 |
| Mount Orientation: | Straight |
| Operating Temperature Range: | -40 - 105 °C |
| SKU: | EDA337-018-500-603 |
337-018-500-603
| Heilind Number: | EDA337-018-500-603 |
| Manufacturer: | EDAC |
| Manufacturer Number: | 337-018-500-603 |
| ECAD Model: |
Description:
337 Series (.156" (3.96mm) contact spacing) Card Edge Connector with 18 Wire Hole type contacts. The tails are .050" x .025" (1.27mm x 0.64mm) thick and .260" (6.60mm) long in a Single Row formation. The Insulator is Green in color and has .170" (4.32mm) Offset Mounting Lugs with
More >>Specifications
Detailed Description
Enhance your PCB connections with our Card Edge Connector, a vital component for seamless board-to-board integration. Engineered for high performance, this connector features a single row design with 18 positions, ensuring reliable connectivity in your electronic systems. Crafted from durable UL 94V-0 Thermoplastic Polyester in a vibrant green hue, it not only meets stringent safety standards but also adds a pop of color to your assembly. The copper alloy contact material guarantees efficient signal transmission, while a 3A amperage rating supports power-intensive applications. With a pitch of .156 inches and row spacing of .2 inches, precise alignment is effortless during installation. Operating flawlessly in temperatures ranging from -40 to 105°C, this connector is well-suited for a variety of environments, from industrial settings to consumer electronics. Trust in its straight mount orientation for seamless PCB integration, making it an indispensable solution for your connectivity needs. Elevate your design with this essential component, offering both functionality and durability in one compact package.

