887-034-542-202

Heilind Number:EDA887-034-542-202
Manufacturer:EDAC
Manufacturer Number:887-034-542-202
ECAD Model:
3D Model

Description:

High Temp Card Edge Connector

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Specifications

AttributeValue
Product Category:
Manufacturer:EDAC
Manufacturer Part Number:EDAC 887-034-542-202
Color:Black
Amperage:3 A
Housing Material:UL 94V-0 Polyphenylene Sulfide
Number of Rows:2
Contact Material:Copper Alloy
Pitch:.156 in
Row Spacing:.2 in
Number of Positions:34
Mount Orientation:Straight
Operating Temperature Range:-40 - 105 °C
SKU:EDA887-034-542-202

Detailed Description

Upgrade your connection system with our high-temp card edge connector, designed for optimal performance in demanding environments. With a sleek black housing made of UL 94V-0 Polyphenylene Sulfide, this connector ensures durability and reliability. Boasting a double row design and 34 positions, it offers ample connectivity options for your PCB setup. The copper alloy contact material guarantees efficient signal transmission, while the .156-inch pitch and .2-inch row spacing provide precise alignment. Suitable for straight mounting orientation, it's easy to integrate into your system. Operating flawlessly in temperatures ranging from -40 to 105°C, this connector is a must-have for industrial applications requiring high-performance connectivity. Upgrade your connection system with our high-temp card edge connector, designed for optimal performance in demanding environments. With a sleek black housing made of UL 94V-0 Polyphenylene Sulfide, this connector ensures durability and reliability. Boasting a double row design and 34 positions, it offers ample connectivity options for your PCB setup. The copper alloy contact material guarantees efficient signal transmission, while the .156-inch pitch and .2-inch row spacing provide precise alignment. Suitable for straight mounting orientation, it's easy to integrate into your system. Operating flawlessly in temperatures ranging from -40 to 105°C, this connector is a must-have for industrial applications requiring high-performance connectivity.