896-008-558-608

Heilind Number:EDA896-008-558-608
Manufacturer:EDAC
Manufacturer Number:896-008-558-608
ECAD Model:
3D Model

Description:

High Temp Card Edge Connectors

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Specifications

AttributeValue
Product Category:
Manufacturer:EDAC
Manufacturer Part Number:EDAC 896-008-558-608
Color:Black
Amperage:3 A
Housing Material:UL 94V-0 Polyphenylene Sulfide
Number of Rows:1
Contact Material:Copper Alloy
Pitch:.125 in
Row Spacing:.2 in
Number of Positions:8
Mount Orientation:Right Angle
Operating Temperature Range:-40 - 105 °C
SKU:EDA896-008-558-608

Detailed Description

Elevate your electronic connections with our high temperature Card Edge Connectors. Designed for optimal performance in demanding environments, these connectors feature a sleek black housing made of UL 94V-0 Polyphenylene Sulfide, ensuring both durability and safety. With a single row configuration and eight positions, they offer seamless integration for your PCB setup. The contact material, crafted from Copper Alloy, guarantees reliable conductivity, while the .125 inch pitch and .2 inch row spacing provide efficient signal transmission. Perfect for compact designs, these connectors boast a right angle mount orientation. Operating flawlessly in temperatures ranging from -40 to 105°C, they are a dependable choice for your application. Elevate your electronic connections with our high temperature Card Edge Connectors. Designed for optimal performance in demanding environments, these connectors feature a sleek black housing made of UL 94V-0 Polyphenylene Sulfide, ensuring both durability and safety. With a single row configuration and eight positions, they offer seamless integration for your PCB setup. The contact material, crafted from Copper Alloy, guarantees reliable conductivity, while the .125 inch pitch and .2 inch row spacing provide efficient signal transmission. Perfect for compact designs, these connectors boast a right angle mount orientation. Operating flawlessly in temperatures ranging from -40 to 105°C, they are a dependable choice for your application.