| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 106283-1005 |
| Series: | 106283 - MTP - QSFP Plus - QSFP |
| Connector Type: | MTP, QSFP Plus |
| Mode Type: | Multimode Enhanced |
| Fiber Size: | 50/125 µm |
| Cable Diameter: | 3 mm |
| Wire Type: | OM3 Plenum |
| Cable Length: | 5 m |
| Boot Type: | Straight |
| Connector To Connector: | MTP to MTP |
| Part Aliases: | 1062831005 |
| SKU: | MOL106283-1005 |
106283-1005
| Heilind Number: | MOL106283-1005 |
| Manufacturer: | Molex |
| Manufacturer Number: | 106283-1005 |
| Datasheet: | Drawing |
| ECAD Model: |
Description:
Quad Small Form-factor Pluggable (QSFP) Optical Jumper Cable Assembly, 4 TX, 4 RX; 8 Fiber MTP Multimode 50/125µm 3.00mm Round Cable Plenum, High Bandwidth (OM3), 5.0m (16.40') Length, Aqua Cable
More >>Specifications
Detailed Description
Enhance your network connectivity with our Quad Small Form-factor Pluggable (QSFP) Optical Jumper Cable Assembly. This high-performance cable features 4 TX and 4 RX channels, ensuring seamless data transmission. With an 8 Fiber MTP Multimode 50/125µm construction and OM3 Plenum cable technology, it guarantees optimal signal integrity over its 5m length. The Aqua 3.00mm Round Cable design not only offers durability but also complies with RoHS standards, making it a reliable and eco-friendly choice. Perfect for high-bandwidth applications, this cable is a must-have for efficient data transfer in any professional setting.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 06/25/2025 | 516434 - Change to product. Removal of white marks from USCONEC MTP Connectors & Housings | Download | |||
| 03/22/2016 | GCM 10709223 - Change Construction Or Material. Molex supplier is changing material of MTP and MXC connector crimp bands to eliminate the need of claiming RoHS exemption 6(c). New aluminum crimp bands are completely lead-free and offer improved aesthetic consistency. New crimp bands were tested side by side with legacy crimp bands and were found to have equivalent performance. | Download | |||
| 12/30/2015 | GCM 10685369 - Manufacturing Process Change. This letter is to inform you that as part of our Continuous Improvement program, we are modifying the speed, time, pressure and lapping film sequence in the polishing process in order to reduce the scratches and pits of the product and then increasing the first pass yield. This change will not affect the performance of the products. | Download | |||

