| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 170432-0001 |
| Color: | Black |
| Series: | 170432 - zQSFP Plus - zQSFP |
| Amperage: | .5 A |
| Connector Type: | zQSFP Plus |
| Number of Rows: | 1 |
| Termination Method: | Surface Mount |
| Contact Material: | Copper Alloy |
| Pitch: | 8 mm |
| Voltage: | 30 V AC/DC |
| Material: | Thermoplastic |
| Number of Ports: | 1 |
| Orientation: | Right Angle |
| Keying: | No |
| Component Type: | Receptacle |
| Packaging: | Embossed Tape on Reel |
| Contact Mating Area Plating: | Gold over Nickel |
| Contact Mating Area Plating Thickness: | .381 µm |
| Ground to Panel / PCB: | Yes |
| Number of Contacts Loaded: | 38 |
| Mating Cycles: | 50 |
| PCB Retention: | Yes |
| Supplier Product Group: | High Speed Cage & Connector Assemblies |
| Connector System: | Board to Board, Module to Board, Wire to Board |
| UL Agency Certification: | E29179 |
| Electrical Model: | Yes |
| Lock to Mating Part: | Yes |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 1704320001 |
| SKU: | MOL170432-0001 |
170432-0001
| Heilind Number: | MOL170432-0001 |
| Manufacturer: | Molex |
| Manufacturer Number: | 170432-0001 |
| Datasheet: | Product Specification |
| ECAD Model: |
Description:
zQuad Small Form Factor Pluggable Plus (zQSFP+) Assembly, Surface Mount, 38 Circuits, Gold (Au) Plated 0.381?m, Supports QSFP28 / EDR
More >>Specifications
Detailed Description
Introducing the zQuad Small Form Factor Pluggable Plus (zQSFP+) Assembly, a high-speed connector designed for seamless surface mount installation. This black connector features 38 gold-plated circuits with a thickness of 0.381μm, ensuring reliable performance for QSFP28 and EDR applications. With a current rating of 0.5A and voltage capacity of 30V AC/DC, it offers robust power delivery. Crafted from durable thermoplastic and copper alloy, it guarantees longevity. This right-angle connector, ideal for board-to-board, wire-to-board, and module-to-board connections, complies with RoHS standards and is UL certified for quality assurance. With features like PCB retention and lock-to-mating part mechanism, it ensures secure and stable connectivity. Perfect for high-speed data transmission, this component is a valuable addition to any system requiring efficient signal transfer.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 07/12/2026 | 517735 - Packaging Method/Quantity Changing. products will undergo changes for packaging specification change. No changes will be made to product as part of this change. | Download | |||
| 01/31/2024 | 514009 - Packaging Method/Quantity Changing. This notification is to inform you about the following changes that are being made to the packaging of ZQSFP+ SMT Connector . Change: To standardize the packaging for ZQSFP+ connectors, we are moving away from using the corner guides and white bubble form & switching to pink bubble form. | Download | |||
| 06/14/2019 | 506859 - Capacity change or tool replacement. Another set of tooling is being added to meet the current and future demands of this product. | Download | |||

