171224-1011

Heilind Number:MOL171224-1011
Manufacturer:Molex
Manufacturer Number:171224-1011
Datasheet:Product Specification
ECAD Model:
3D Model

Description:

zSFP+ Stacked Ganged Assembly with Metal Spring Fingers, 2-by-1 With 4 Light Pipes, 40 Circuits

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 171224-1011
Color:Black
Series:171224 - zSFP Plus - zSFP
Amperage:.5 A
Connector Type:zSFP Plus
Gender:Female
Number of Rows:2
Termination Method:Through Hole - Compliant Pin
Contact Material:High Performance Alloy (HPA)
Contact Plating:Gold
Body Orientation:Right Angle
Pitch:8 mm
Voltage:30 V AC
Material:Thermoplastic
Number of Ports:2
Orientation:Right Angle
Component Type:Receptacle
Packaging:Tray
Operating Temperature Range:-40 - 85 °C
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.762 µm
Number of Contacts Loaded:40
Mating Cycles:100
PCB Locator:Yes
Shielded:Yes
PCB Retention:Yes
Polarized to PCB:Yes
Contact Termination Plating Thickness:.762 µm
Polarized to Mate:Yes
PCB Thickness (Recommended):2.36 mm
Supplier Product Group:High Speed Cage & Connector Assemblies
Connector System:Module to Board
UL Agency Certification:E29179
Contact Termination Plating:Matte Tin
Termination Pitch:.8 mm
Lock to Mating Part:Yes
Surface Mount Compatible:No
Material Flammability Standard:94V-0
Part Aliases:1712241011
SKU:MOL171224-1011

Detailed Description

Elevate your high-speed connectivity with our zSFP+ Stacked Ganged Assembly, featuring a robust design with Metal Spring Fingers for secure connections. This female connector boasts two rows and 40 circuits, ideal for demanding applications. With a right-angle body orientation and through-hole termination method, it ensures reliable performance. The high-performance alloy contact material, gold plating, and 30V AC voltage rating guarantee optimal conductivity. Designed for durability, this assembly is shielded, RoHS compliant, and suitable for operating temperatures ranging from -40 to 85°C. Perfect for Module to Board connections, it offers exceptional signal integrity and longevity in high-speed data transmission setups. Upgrade your connectivity solutions with this essential component.