171224-1012

MOL171224-1012
Heilind Number:MOL171224-1012
Manufacturer:Molex
Manufacturer Number:171224-1012
Datasheet:Drawing
ECAD Model:
3D Model

Description:

zSFP+ Stacked Ganged Assembly with Metal Spring Fingers, 2-by-1 with Inner Light Pipes, 40 Circuits

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Specifications

AttributeValue
Product Category:
High Speed Connectors & Components High Speed Cage & Connector Assemblies
Manufacturer:Molex
Manufacturer Part Number:Molex 171224-1012
Color:Black
Series:171224 - zSFP Plus - zSFP+
Amperage:.5 A
Gender:Female
Number of Rows:2
Termination Method:Through Hole - Compliant Pin
Contact Material:High Performance Alloy (HPA)
Pitch:8 mm
Voltage:30 V AC
Material:High Temperature Thermoplastic
Number of Ports:2
Orientation:Right Angle
Component Type:Receptacle
Packaging:Tray
Circuit Application:Module-to-Board
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.762 µm
Number of Contacts Loaded:40
Mating Cycles:100
PCB Locator:Yes
Shielded:Yes
PCB Retention:Yes
Polarized to PCB:Yes
Contact Termination Plating Thickness:.762 µm
Polarized to Mate:Yes
PCB Thickness (Recommended):2.36 mm
UL Agency Certification:E29179
Contact Termination Plating:Matte Tin
Termination Pitch:.8 mm
Lock to Mating Part:Yes
Surface Mount Compatible:No
Product Name:zSFP+, zSFP Plus
Material Flammability Standard:94V-0
Part Aliases:1712241012
SKU:MOL171224-1012

Detailed Description

Enhance high-speed connectivity with our zSFP+ Stacked Ganged Assembly, featuring a robust design with Metal Spring Fingers for secure connections. This 2-by-1 assembly, complete with Inner Light Pipes, ensures efficient data transmission across 40 circuits. Crafted from durable materials, including High Temperature Thermoplastic and High Performance Alloy, it guarantees reliability even in demanding environments. With features like PCB retention, polarization, and gold plating, this assembly offers seamless integration and long-lasting performance. UL certified and RoHS compliant, it meets stringent quality standards, making it the ideal choice for module-to-board applications in various industries. Elevate your connectivity solutions with our zSFP+ assembly.