171224-1013

MOL171224-1013
Heilind Number:MOL171224-1013
Manufacturer:Molex
Manufacturer Number:171224-1013
Datasheet:Drawing
ECAD Model:
3D Model

Description:

zSFP+ Stacked Ganged Assembly with Metal Spring Fingers, 2-by-1 with Outer Down/Up Light Pipes, 40 Circuits

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Specifications

AttributeValue
Product Category:
High Speed Connectors & Components High Speed Cage & Connector Assemblies
Manufacturer:Molex
Manufacturer Part Number:Molex 171224-1013
Color:Black
Series:171224 - zSFP Plus - zSFP+
Amperage:.5 A
Gender:Female
Number of Rows:2
Termination Method:Through Hole - Compliant Pin
Contact Material:High Performance Alloy (HPA)
Pitch:8 mm
Voltage:30 V AC
Shield Type:EMI Fingers
Material:High Temperature Thermoplastic
Number of Ports:2
Orientation:Right Angle
Component Type:Receptacle
Packaging:Tray
Circuit Application:Module-to-Board
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.762 µm
Number of Contacts Loaded:40
Mating Cycles:100
PCB Locator:Yes
Shielded:Yes
PCB Retention:Yes
Polarized to PCB:Yes
Contact Termination Plating Thickness:.762 µm
Polarized to Mate:Yes
PCB Thickness (Recommended):1.57 mm
UL Agency Certification:E29179
Contact Termination Plating:Matte Tin
Termination Pitch:.8 mm
Lock to Mating Part:Yes
Surface Mount Compatible:No
Product Name:zSFP+, zSFP Plus
Material Flammability Standard:94V-0
Part Aliases:1712241013
SKU:MOL171224-1013

Detailed Description

Enhance signal integrity with our zSFP+ Stacked Ganged Assembly, designed for high-speed data transmission. Featuring two rows of contacts for seamless connectivity, this receptacle boasts EMI shielding and durable construction for reliable performance. The right-angle orientation and PCB locator ensure easy installation, while gold plating and high-performance alloy contacts guarantee optimal conductivity. With a rugged thermoplastic housing and metal spring fingers, this assembly is perfect for demanding applications. RoHS compliant and UL certified, it meets stringent quality standards for peace of mind. Elevate your connectivity with this essential component for module-to-board communication.