| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 171224-4013 |
| Color: | Black |
| Series: | 171224 - zSFP Plus - zSFP+ |
| Amperage: | .5 A |
| Gender: | Female |
| Number of Rows: | 2 |
| Termination Method: | Through Hole - Compliant Pin |
| Contact Material: | High Performance Alloy (HPA) |
| Pitch: | 8 mm |
| Voltage: | 30 V AC |
| Material: | High Temperature Thermoplastic |
| Number of Ports: | 8 |
| Orientation: | Right Angle |
| Component Type: | Receptacle |
| Packaging: | Tray |
| Circuit Application: | Module-to-Board |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 160 |
| Mating Cycles: | 100 |
| PCB Locator: | Yes |
| Shielded: | Yes |
| PCB Retention: | Yes |
| Polarized to PCB: | Yes |
| Contact Termination Plating Thickness: | .762 µm |
| Polarized to Mate: | Yes |
| PCB Thickness (Recommended): | 2.36 mm |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Matte Tin |
| Termination Pitch: | .8 mm |
| Lock to Mating Part: | Yes |
| Surface Mount Compatible: | No |
| Product Name: | zSFP+, zSFP Plus |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 1712244013 |
| SKU: | MOL171224-4013 |
171224-4013
| Heilind Number: | MOL171224-4013 |
| Manufacturer: | Molex |
| Manufacturer Number: | 171224-4013 |
| Datasheet: | Product Specification |
| ECAD Model: | |
Description:
zSFP+ Stacked Ganged Assembly with Metal Spring Fingers, 2-by-4 with Outer Down/Up Light Pipes, 160 Circuits
More >>Specifications
Detailed Description
Introducing our zSFP+ Stacked Ganged Assembly with Metal Spring Fingers, featuring a 2-by-4 configuration with Outer Down/Up Light Pipes for seamless connectivity. With 160 circuits in a sleek black design, this assembly is a high-performance solution for your connectivity needs. The female gender and two rows of termination points ensure secure connections, while the through-hole compliant pin method guarantees reliability. Crafted with High Performance Alloy (HPA) contact material and gold plating, it offers optimal conductivity. Operating at up to 30V AC, this assembly is suitable for a range of applications. RoHS compliant and UL certified, it meets stringent quality standards. Perfect for Module-to-Board connections, this assembly is designed for durability, with a mating cycle of 100. Its right-angle orientation and shielded design make it ideal for high-speed data transmission. Whether for industrial or commercial use, this assembly guarantees performance and reliability. Elevate your connectivity with our zSFP+ Stacked Ganged Assembly.
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Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |
Additional Resources
| Attribute | Value |
|---|---|
| Molex: | 171224-4013 |
| Other Names: | 1712244013 |