171224-6011

Heilind Number:MOL171224-6011
Manufacturer:Molex
Manufacturer Number:171224-6011
Datasheet:Product Specification
ECAD Model:
3D Model

Description:

zSFP+ Stacked Ganged Assembly with Metal Spring Fingers, 2-by-6 with 4 Light Pipes, 240 Circuits

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 171224-6011
Color:Black
Series:171224 - zSFP Plus - zSFP
Amperage:.5 A
Connector Type:zSFP Plus
Gender:Female
Number of Rows:2
Termination Method:Through Hole - Compliant Pin
Contact Material:High Performance Alloy (HPA)
Contact Plating:Gold
Body Orientation:Right Angle
Pitch:8 mm
Voltage:30 V AC
Material:Thermoplastic
Number of Ports:12
Orientation:Right Angle
Component Type:Receptacle
Packaging:Tray
Operating Temperature Range:-40 - 85 °C
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.762 µm
Number of Contacts Loaded:240
Mating Cycles:100
PCB Locator:Yes
Shielded:Yes
PCB Retention:Yes
Polarized to PCB:Yes
Contact Termination Plating Thickness:.762 µm
Polarized to Mate:Yes
PCB Thickness (Recommended):2.36 mm
Supplier Product Group:High Speed Cage & Connector Assemblies
Connector System:Module to Board
UL Agency Certification:E29179
Contact Termination Plating:Matte Tin
Termination Pitch:.8 mm
Lock to Mating Part:Yes
Surface Mount Compatible:No
Material Flammability Standard:94V-0
Part Aliases:1712246011
SKU:MOL171224-6011

Detailed Description

Enhance your connectivity with this zSFP+ Stacked Ganged Assembly featuring Metal Spring Fingers, perfect for demanding applications. Designed with precision, this assembly boasts 240 circuits, 2 rows, and 4 light pipes for optimal performance. With a body orientation of right angle and through-hole termination method, it ensures secure and reliable connections. The high-performance alloy contact material with gold plating guarantees excellent conductivity, while the thermoplastic housing offers durability. Meeting stringent standards for flammability and RoHS compliance, this assembly is not only efficient but also environmentally friendly. Ideal for high-speed data transmission, it's a valuable addition to any setup requiring a superior connectivity solution.