171224-6031

Heilind Number:MOL171224-6031
Manufacturer:Molex
Manufacturer Number:171224-6031
Datasheet:Product Specification
ECAD Model:
3D Model

Description:

zSFP+ Stacked Ganged Assembly with Metal Spring Fingers, 2-by-6 with Inner Light Pipes, Vented, 240 Circuits

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 171224-6031
Color:Black
Series:171224 - zSFP Plus - zSFP
Amperage:.5 A
Connector Type:zSFP Plus
Gender:Female
Number of Rows:2
Termination Method:Through Hole - Compliant Pin
Contact Material:High Performance Alloy (HPA)
Pitch:8 mm
Voltage:30 V AC
Shield Type:EMI Fingers
Material:Thermoplastic
Number of Ports:12
Orientation:Right Angle
Component Type:Receptacle
Packaging:Tray
Operating Temperature Range:-40 - 85 °C
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.762 µm
Number of Contacts Loaded:240
Mating Cycles:100
PCB Locator:Yes
Shielded:Yes
PCB Retention:Yes
Polarized to PCB:Yes
Contact Termination Plating Thickness:.762 µm
Polarized to Mate:Yes
PCB Thickness (Recommended):1.57 mm
Connector System:Module to Board
UL Agency Certification:E29179
Contact Termination Plating:Matte Tin
Termination Pitch:.8 mm
Lock to Mating Part:Yes
Surface Mount Compatible:No
Material Flammability Standard:94V-0
Part Aliases:1712246031
SKU:MOL171224-6031

Detailed Description

Upgrade your high-speed connectivity with our zSFP+ Stacked Ganged Assembly. This cutting-edge component features a 2-by-6 configuration with inner light pipes, offering optimal performance for your data transmission needs. Crafted with precision, it boasts 240 circuits and is vented for enhanced cooling efficiency. The sleek black design, complemented by metal spring fingers, not only ensures durability but also provides EMI shielding. With a contact material of High Performance Alloy (HPA) and gold plating, it guarantees reliable conductivity. Suitable for through-hole installation, it is polarized and securely locks into place, making it ideal for demanding applications. RoHS compliant and UL certified, this assembly is a must-have for seamless Module to Board connections in your setup. Upgrade your high-speed connectivity with our zSFP+ Stacked Ganged Assembly. This cutting-edge component features a 2-by-6 configuration with inner light pipes, offering optimal performance for your data transmission needs. Crafted with precision, it boasts 240 circuits and is vented for enhanced cooling efficiency. The sleek black design, complemented by metal spring fingers, not only ensures durability but also provides EMI shielding. With a contact material of High Performance Alloy (HPA) and gold plating, it guarantees reliable conductivity. Suitable for through-hole installation, it is polarized and securely locks into place, making it ideal for demanding applications. RoHS compliant and UL certified, this assembly is a must-have for seamless Module to Board connections in your setup.