| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 171298-1707 |
| Color: | Black |
| Series: | 171298 - Impact |
| Amperage: | .75 A |
| Connector Type: | Impact |
| Number of Contacts: | 252 |
| Number of Rows: | 18 |
| Termination Method: | Through Hole - Compliant Pin |
| Contact Material: | High Performance Alloy (HPA) |
| Pitch: | 1.9 mm |
| Voltage: | 30 V AC/DC |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Impedance: | 100 Ω |
| Keying: | No |
| Component Type: | PCB Header |
| Number of Pairs: | 6 |
| Data Rate: | 25 Gb/s |
| Tail Length: | 1.4 mm |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .254 µm |
| Number of Contacts Loaded: | 252 |
| Mating Cycles: | 200 |
| PCB Locator: | No |
| Shielded: | No |
| PCB Retention: | Without |
| Polarized to PCB: | No |
| PCB Thickness (Recommended): | 1 mm |
| Number of Columns: | 14 |
| Contact Termination Plating: | Tin |
| Termination Pitch: | 1.9 mm |
| Guide to Mating Part: | No |
| Stackable: | No |
| Board to Board Configuration: | Conventional |
| Make First / Break Last: | No |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 1712981707 |
| SKU: | MOL171298-1707 |
171298-1707
| Heilind Number: | MOL171298-1707 |
| Manufacturer: | Molex |
| Manufacturer Number: | 171298-1707 |
| Datasheet: | Datasheet |
| ECAD Model: |
Description:
Impact 100 Ohm 6 Pair Vertical Backplane Header, Unguided, Open Endwall, 14 Columns, 252 Circuits, Pin Length 4.90mm, Plated Through Hole Dimension 0.39mm, Matte Tin, 0.254µm Gold
More >>Specifications
Detailed Description
Enhance your backplane connectivity with this Impact 100 Ohm 6 Pair Vertical Backplane Header. Featuring an unguided design with an open endwall, this header is meticulously crafted with 252 circuits, each with a pin length of 4.90mm. The plated through hole technology ensures reliable performance, with a dimension of 0.39mm and a finish of Matte Tin with 0.254µm Gold. Its high-performance alloy contact material guarantees efficient power transmission, while its high-temperature thermoplastic construction ensures durability. Operating at a voltage of 30V AC/DC and an amperage of .75A, this header is ideal for high-speed applications, with a data rate of 25 Gb/s. Its compact pitch of 1.9mm and vertical orientation make it suitable for space-constrained PCB layouts. With a mating cycle of 200, this header offers long-lasting connectivity for your electronic designs, whether in industrial or commercial settings. Explore seamless board-to-board configurations with this essential component, designed to meet your connectivity needs with precision and reliability.

