171298-1707

Heilind Number:MOL171298-1707
Manufacturer:Molex
Manufacturer Number:171298-1707
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

Impact 100 Ohm 6 Pair Vertical Backplane Header, Unguided, Open Endwall, 14 Columns, 252 Circuits, Pin Length 4.90mm, Plated Through Hole Dimension 0.39mm, Matte Tin, 0.254µm Gold

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 171298-1707
Color:Black
Series:171298 - Impact
Amperage:.75 A
Connector Type:Impact
Number of Contacts:252
Number of Rows:18
Termination Method:Through Hole - Compliant Pin
Contact Material:High Performance Alloy (HPA)
Pitch:1.9 mm
Voltage:30 V AC/DC
Material:High Temperature Thermoplastic
Orientation:Vertical
Impedance:100 Ω
Keying:No
Component Type:PCB Header
Number of Pairs:6
Data Rate:25 Gb/s
Tail Length:1.4 mm
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.254 µm
Number of Contacts Loaded:252
Mating Cycles:200
PCB Locator:No
Shielded:No
PCB Retention:Without
Polarized to PCB:No
PCB Thickness (Recommended):1 mm
Number of Columns:14
Contact Termination Plating:Tin
Termination Pitch:1.9 mm
Guide to Mating Part:No
Stackable:No
Board to Board Configuration:Conventional
Make First / Break Last:No
Material Flammability Standard:94V-0
Part Aliases:1712981707
SKU:MOL171298-1707

Detailed Description

Enhance your backplane connectivity with this Impact 100 Ohm 6 Pair Vertical Backplane Header. Featuring an unguided design with an open endwall, this header is meticulously crafted with 252 circuits, each with a pin length of 4.90mm. The plated through hole technology ensures reliable performance, with a dimension of 0.39mm and a finish of Matte Tin with 0.254µm Gold. Its high-performance alloy contact material guarantees efficient power transmission, while its high-temperature thermoplastic construction ensures durability. Operating at a voltage of 30V AC/DC and an amperage of .75A, this header is ideal for high-speed applications, with a data rate of 25 Gb/s. Its compact pitch of 1.9mm and vertical orientation make it suitable for space-constrained PCB layouts. With a mating cycle of 200, this header offers long-lasting connectivity for your electronic designs, whether in industrial or commercial settings. Explore seamless board-to-board configurations with this essential component, designed to meet your connectivity needs with precision and reliability.