| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 171315-9108 |
| Color: | Black |
| Series: | 171315 - Impel |
| Amperage: | .75 A |
| Connector Type: | Impel |
| Number of Contacts: | 80 |
| Number of Rows: | 8 |
| Contact Material: | High Performance Alloy (HPA) |
| Pitch: | 1.9 mm |
| Voltage: | 150 V AC/DC |
| Shield Type: | Full Shield |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Impedance: | 92 Ω |
| Keying: | No |
| Component Type: | PCB Header |
| Number of Pairs: | 4 |
| Data Rate: | 40 Gb/s |
| Tail Length: | 1.3 mm |
| Packaging: | Tray |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 80 |
| Mating Cycles: | 200 |
| PCB Locator: | No |
| PCB Retention: | Without |
| PCB Thickness (Recommended): | 1 mm |
| Number of Columns: | 10 |
| Contact Termination Plating: | Tin |
| Termination Pitch: | 1.9 mm |
| Guide to Mating Part: | Yes |
| Board to Board Configuration: | Backplane |
| Make First / Break Last: | No |
| Part Aliases: | 1713159108 |
| SKU: | MOL171315-9108 |
171315-9108
| Heilind Number: | MOL171315-9108 |
| Manufacturer: | Molex |
| Manufacturer Number: | 171315-9108 |
| Datasheet: | Application Specification |
| ECAD Model: |
Description:
Impel 92 Ohm, 4 Pair Vertical Backplane Header, 1.90mm Pitch, Right Guided, with Endwall, 10 Columns, 80 Circuits, Pin Length 5.50mm, PlatedThrough Hole Dimension 0.36mm
More >>Specifications
Detailed Description
Introducing the Impel 92 Ohm Vertical Backplane Header, designed for high-speed connectivity in electronic systems. This component features 80 circuits, divided into 4 pairs for efficient data transmission. With a 1.90mm pitch and right-guided orientation, it ensures precise alignment on the PCB. The 10 columns offer ample connectivity options, while the 5.50mm pin length and plated-through hole design enhance durability. Made from high-temperature thermoplastic and high-performance alloy, it guarantees reliability in demanding environments. With a data rate of 40 Gb/s and impedance of 92 Ω, it enables seamless signal transfer. The full shield and gold contact plating provide excellent conductivity, while the tin termination ensures easy installation. Perfect for backplane configurations, this header is a crucial component for robust and efficient electronic systems.

