| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 171574-7835 |
| Color: | Black |
| Series: | 171574 - Impact |
| Amperage: | .75 A |
| Connector Type: | Impact |
| Number of Contacts: | 96 |
| Number of Rows: | 12 |
| Termination Method: | Through Hole - Compliant Pin |
| Contact Material: | High Performance Alloy (HPA) |
| Pitch: | 1.9 mm |
| Voltage: | 30 V AC/DC |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Impedance: | 100 Ω |
| Keying: | No |
| Component Type: | PCB Header |
| Number of Pairs: | 4 |
| Data Rate: | 25 Gb/s |
| Tail Length: | 1.4 mm |
| Packaging: | Tray |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 96 |
| Mating Cycles: | 200 |
| PCB Locator: | No |
| Shielded: | No |
| PCB Retention: | Yes |
| Polarized to PCB: | Yes |
| PCB Thickness (Recommended): | 1 mm |
| Number of Columns: | 8 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Tin |
| Termination Pitch: | 1.9 mm |
| Guide to Mating Part: | Yes |
| Stackable: | No |
| Board to Board Configuration: | Orthogonal Direct |
| Make First / Break Last: | No |
| Part Aliases: | 1715747835 |
| SKU: | MOL171574-7835 |
171574-7835
| Heilind Number: | MOL171574-7835 |
| Manufacturer: | Molex |
| Manufacturer Number: | 171574-7835 |
| Datasheet: | Drawing |
| ECAD Model: |
Description:
Impact 100 Ohm 4-Pair Right-Angle Orthogonal Direct Header, Top Guided, with Outrigger, 8 Column, 32 Differential Pair, 270ËšMate Position, Pin Length 5.50mm, Plated Through-Hole Dimension 0.46mm, Lead Free
More >>Specifications
Detailed Description
Enhance your PCB connections with this Impact 100 Ohm 4-Pair Right-Angle Orthogonal Direct Header. Featuring a top-guided design with an outrigger, this header boasts 8 columns and 32 differential pairs for efficient signal transmission. With a 270-degree mate position and 5.50mm pin length, it ensures secure and stable connectivity. Made of high-performance alloy and high-temperature thermoplastic, it guarantees durability and reliability in operation. Its gold-plated contact mating area and tin termination provide optimal conductivity, while its 1.9mm pitch and 1mm PCB thickness offer seamless integration. With a data rate of 25 Gb/s and a mating cycle of 200, it's ideal for high-speed applications. RoHS compliant and UL certified, it meets stringent quality standards. Perfect for backplane connectors and board-to-board configurations, this header is a must-have for your connectivity needs.

