| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 171722-1001 |
| Color: | Black |
| Series: | 171722 - zQSFP Plus - zQSFP+ |
| Amperage: | .5 A |
| Number of Contacts: | 76 |
| Number of Rows: | 2 |
| Termination Method: | Through Hole - Compliant Pin |
| Contact Material: | Copper Alloy |
| Pitch: | 8 mm |
| Voltage: | 30 V AC/DC |
| Shield Type: | EMI Fingers |
| Material: | High Temperature Thermoplastic |
| Number of Ports: | 2 |
| Orientation: | Right Angle |
| Keying: | No |
| Component Type: | Receptacle |
| Tail Length: | 1.2 mm |
| Packaging: | Tray |
| Circuit Application: | Module-to-Board |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Ground to Panel / PCB: | Yes |
| Number of Contacts Loaded: | 76 |
| Mating Cycles: | 100 |
| PCB Locator: | Yes |
| PCB Retention: | Yes |
| Polarized to PCB: | Yes |
| Contact Termination Plating Thickness: | .762 µm |
| Polarized to Mate: | Yes |
| PCB Thickness (Recommended): | 1.57 mm |
| Connector System: | Board to Board, Wire to Board |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Matte Tin |
| Electrical Model: | Yes |
| Lock to Mating Part: | Yes |
| Surface Mount Compatible: | No |
| Product Name: | zQSFP+, zQSFP Plus |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 1717221001 |
| SKU: | MOL171722-1001 |
171722-1001
| Heilind Number: | MOL171722-1001 |
| Manufacturer: | Molex |
| Manufacturer Number: | 171722-1001 |
| Datasheet: | Application Specification |
| ECAD Model: |
Description:
zQuad Small Form Factor Pluggable Plus (zQSFP+) Stacked Integrated 2-by-1, Connector and Cage with EMI Spring Finger, 76 Circuit, Gold (Au) Over Nickel Plated, No Light Pipe
More >>Specifications
Detailed Description
Introducing the zQuad Small Form Factor Pluggable Plus (zQSFP+) Stacked Integrated 2-by-1 Connector and Cage with EMI Spring Finger. This high-performance component features 76 gold (Au) contacts over nickel plating, ensuring reliable conductivity. Designed for seamless integration, it boasts a compact black housing with no light pipe, ideal for space-constrained applications. With a .8mm pitch and through-hole termination, it offers easy installation on boards. The inclusion of EMI spring fingers and high-temperature thermoplastic construction enhances signal integrity and durability. Perfect for high-speed data transmission, this connector is RoHS compliant and meets stringent quality standards. Explore the versatility of the zQSFP Plus, zQSFP+ series for your connectivity needs.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 10/03/2016 | 501582 - Capacity change or tool replacement. This letter is to inform you that another set of tooling is being added to meet the current and future demands of this product. There will be no changes in the fit, form or function from the additional tooling when compared to the current tooling. | Download | |||
| 04/29/2016 | 500741 - Capacity change or tool replacement. This letter is to inform you that another set of tooling is being added to meet the current and future demands of this product. There will be no changes in the fit, form or function from the additional tooling when compared to the current tooling. | Download | |||
| 01/01/2016 | GCM 10730795 - New, Modified, Or Replacement Tooling. Molex is buildling 2 new molds for better production capacity of the Lightpipe and housing component used in zQSFP+ connector. The gating point of the housing new mold will be different from the current mold as shown. Both new molds will be used in production at Molex Singapore Plant. This change will not affect Form, Fit, or Function of the product. The new molds will be internally qualified before using for mass production. Products made in or after Jan 16 will contain components from the new mold. | Download | |||
| 12/01/2015 | GCM 10724605 - Supplier Changes To Raw Material. This letter is to informed you that there is a change in manufacturing location from Malaysia to China for plastic resin used in the products listed in the attachment initiated by the plastic resin maker. There is no impact to the product form, fit and function as the raw plastic resin material composition remains unchanged. Brand name is changed as well from Vectra to LAPEROS. | Download | |||

