| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 172316-3206 |
| Series: | 172316 |
| Amperage: | 11 A |
| Housing Material: | Liquid Crystal Polymer |
| Number of Rows: | 2 |
| Contact Plating: | Gold |
| Pitch: | 3.5 mm |
| Voltage: | 600 V AC/DC |
| Orientation: | Right Angle |
| Number of Positions: | 6 |
| Housing Color: | Black |
| Termination Type: | Through Hole |
| Operating Temperature Range: | -40 - 120 °C |
| Circuit Application: | Power |
| Connector System: | Wire to Board |
| Product Name: | Ultra-Fit |
| PCB Tail Length: | 3.2 mm |
| Part Aliases: | 1723163206 |
| SKU: | MOL172316-3206 |
172316-3206
| Heilind Number: | MOL172316-3206 |
| Manufacturer: | Molex |
| Manufacturer Number: | 172316-3206 |
| ECAD Model: |
Description:
Ultra-Fit Right-Angle Header, 3.50mm Pitch, Dual Row, 6 Circuits, 0.38µm Gold (Au) Plating, Black, Glow-Wire Capable
More >>Specifications
Detailed Description
Enhance power connectivity with our Ultra-Fit Right-Angle Header, engineered for optimal performance. Featuring a 3.50mm pitch and dual-row design, this connector ensures secure and efficient 6-circuit connections. With 0.38µm Gold (Au) plating, it guarantees reliable conductivity and durability. The black housing, crafted from Liquid Crystal Polymer, offers both strength and aesthetic appeal. Glow-Wire Capable for added safety, it can withstand temperatures ranging from -40 to 120 °C. RoHS compliant and suitable for wire-to-board applications, the Ultra-Fit Connector System is the perfect choice for demanding power environments.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 04/30/2026 | 517467 - Change Supplier. Due to business decisions, Molex has acquired two new packaging suppliers for two of the most popular packaging options. Change 1 - Tape and reel option: The carrier tape supplier has been updated. Change 2 – Packaging in Tray option: The Tray supplier has been updated. | Download | |||
| 07/24/2024 | 514327 - Change to Product. For continual improvement efforts, Molex has decided to do modify one hole dimension in the PCB and the tolerance in the pitch dimension to improve the manufacturing process in the customer side. | Download | |||
| 09/08/2023 | 513340 - Equipment Transfer, Production Transfer or Rearrangement. Equipment Transfer This notification is to inform you about an equipment transfer that has been used to manufacture impacted parts. Equipment is being moved to a different site location. No changes will be made to product as part of this change | Download | |||
| 08/01/2023 | 513442 - Packaging Method/Quantity Changing. Align the SAP DU with the packaging drawing. | Download | |||

