| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 173112-0080 |
| Part Aliases: | 1731120080 FMP008S104 |
| SKU: | MOL173112-0080 |
173112-0080
Specifications
Frequently Bought Together
| Product | Part # | Description | Stock |
|---|---|---|---|
| Molex 172704-0042 | FCT Mixed Layout D-Sub Housing, Female, Tin-Plated Shell, Polarized, 2 Circuits Unloaded, Black Insulator | ![]() |
| Molex 172704-0147 | FCT High Power Contact, Male, Straight, Solder Cup, 0.8µm Gold Mating Plating, 0.2µm Gold Termination Plating, 20A, 16-12 AWG | ![]() |
| Molex 172704-0155 | FCT High Power Contact, Female, Straight, Solder Cup, 0.8µm Gold Mating Plating, 0.2µm Gold Termination Plating, Split Tine, 20A, 16-12 AWG | ![]() |
| Molex 173107-0646 | FCT ML DSUB RA PC RCPT 3W3 W/ LINCH | ![]() |
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 07/15/2023 | 513774 - Packaging Method/Quantity Changing. The purpose of the change is to align , commanise and make the MLQ and DU global. As a result there is DU change, however the Fit, Form and Function remains the same. The Reason for the change is a corrective action, in that to reduce the incoherence caused between DU and MLQ. The Change is implemented by standardizing the MLQ and DU. | Download | |||


