| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 173112-0081 |
| Part Aliases: | 1731120081 FMP009P104 |
| SKU: | MOL173112-0081 |
173112-0081
Specifications
Frequently Bought Together
| Product | Part # | Description | Stock |
|---|---|---|---|
| Molex 172704-0031 | FCT Mixed Layout D-Sub Housing, Male, Tin-plated Shell with Dimples, 3 Circuits | ![]() |
| Molex 172704-0032 | FCT Mixed Layout D-Sub Housing, Female, Tin-plated Shell, 3 Circuits Unloaded, Green Insulator | ![]() |
| Molex 172704-0155 | FCT High Power Contact, Female, Straight, Solder Cup, 0.8µm Gold Mating Plating, 0.2µm Gold Termination Plating, Split Tine, 20A, 16-12 AWG | ![]() |
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 07/15/2023 | 513774 - Packaging Method/Quantity Changing. The purpose of the change is to align , commanise and make the MLQ and DU global. As a result there is DU change, however the Fit, Form and Function remains the same. The Reason for the change is a corrective action, in that to reduce the incoherence caused between DU and MLQ. The Change is implemented by standardizing the MLQ and DU. | Download | |||


