200989-1122

Heilind Number:MOL200989-1122
Manufacturer:Molex
Manufacturer Number:200989-1122
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

Slim-Grid Header, 22 Circuits, Surface Mount, Vertical, Shrouded, 0.38µm Gold (Au) Plated, with Pick-and-Place Cap, Tube, Lead-Free

Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 200989-1122
Color:Black
Series:200989 - Slim-Grid
Amperage:1.4 A
Connector Type:Slim-Grid
Number of Contacts:22
Number of Rows:2
Termination Method:Surface Mount
Contact Material:Copper Alloy
Pitch:1.27 mm
Voltage:125 V AC
Material:Liquid Crystal Polymer
Orientation:Vertical
Keying:No
Pick and Place:With Pick and Place Cap
Operating Temperature Range:-55 - 105 °C
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.381 µm
Number of Contacts Loaded:22
Mating Cycles:500
PCB Locator:No
PCB Retention:Without
Polarized to PCB:No
Contact Termination Plating Thickness:2 µm
Polarized to Mate:Yes
Connector System:Board to Board
Contact Termination Plating:Matte Tin
Maximum Solder Process Temperature:260 °C
Lead Free Process Capability:REFLOW
Duration at Max. Process Temperature (seconds):010
Max. Cycles at Max. Process Temperature:001
Termination Pitch:1.27 mm
Glow Wire Capable:No
Guide to Mating Part:Yes
Lock to Mating Part:Yes
Breakaway:No
Make First / Break Last:No
Shroud Type:Fully
Material Flammability Standard:94V-0
Part Aliases:200989-1122 2009891122 200989
SKU:MOL200989-1122