204058-6103

Heilind Number:MOL204058-6103
Manufacturer:Molex
Manufacturer Number:204058-6103
Datasheet:Test Summary
ECAD Model:
3D Model

Description:

QSFP-DD Assembly, Stacked 2x1, Closed Top

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 204058-6103
Color:Black
Series:204058 - QSFP-DD
Amperage:.5 A
Gender:Female
Number of Contacts:152
Number of Rows:2
Termination Method:Through Hole - Compliant Pin
Contact Material:Copper Alloy
Pitch:8 mm
Material:High Temperature Thermoplastic
Number of Ports:2
Orientation:Right Angle
Keying:No
Component Type:Receptacle
Tail Length:1.7 mm
Packaging:Tray
Circuit Application:Module-to-Board
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.76 µm
Ground to Panel / PCB:Yes
Number of Contacts Loaded:152
Mating Cycles:100
PCB Locator:Yes
Shielded:Yes
PCB Retention:Yes
Polarized to PCB:Yes
Contact Termination Plating Thickness:.760 µm
Polarized to Mate:Yes
PCB Thickness (Recommended):1.53 mm
CSA Agency Certification:LR19980
UL Agency Certification:E29179
Contact Termination Plating:Tin
Electrical Model:Yes
Lock to Mating Part:Yes
Surface Mount Compatible:No
Product Name:QSFP-DD
Material Flammability Standard:94V-0
Part Aliases:2040586103
SKU:MOL204058-6103

Detailed Description

Enhance high-speed connectivity with our QSFP-DD Assembly, featuring a stacked 2x1 configuration and closed top design. Crafted for optimal performance, this assembly boasts a durable black housing and complies with RoHS standards. With 152 contacts in a 2-row layout, it ensures efficient data transmission. The through-hole termination method with compliant pins guarantees secure attachment to your board. Operating at a low amperage of 0.5A, it offers reliable power delivery. Its right-angle orientation and PCB retention feature make it easy to install. Gold-plated contact mating areas and tin-plated terminations ensure excellent conductivity. Whether for module-to-board connections or other applications, this assembly is a dependable choice in high-speed connectivity solutions.