| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 204058-6103 |
| Color: | Black |
| Series: | 204058 - QSFP-DD |
| Amperage: | .5 A |
| Gender: | Female |
| Number of Contacts: | 152 |
| Number of Rows: | 2 |
| Termination Method: | Through Hole - Compliant Pin |
| Contact Material: | Copper Alloy |
| Pitch: | 8 mm |
| Material: | High Temperature Thermoplastic |
| Number of Ports: | 2 |
| Orientation: | Right Angle |
| Keying: | No |
| Component Type: | Receptacle |
| Tail Length: | 1.7 mm |
| Packaging: | Tray |
| Circuit Application: | Module-to-Board |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .76 µm |
| Ground to Panel / PCB: | Yes |
| Number of Contacts Loaded: | 152 |
| Mating Cycles: | 100 |
| PCB Locator: | Yes |
| Shielded: | Yes |
| PCB Retention: | Yes |
| Polarized to PCB: | Yes |
| Contact Termination Plating Thickness: | .760 µm |
| Polarized to Mate: | Yes |
| PCB Thickness (Recommended): | 1.53 mm |
| CSA Agency Certification: | LR19980 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Tin |
| Electrical Model: | Yes |
| Lock to Mating Part: | Yes |
| Surface Mount Compatible: | No |
| Product Name: | QSFP-DD |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 2040586103 |
| SKU: | MOL204058-6103 |
204058-6103
| Heilind Number: | MOL204058-6103 |
| Manufacturer: | Molex |
| Manufacturer Number: | 204058-6103 |
| Datasheet: | Test Summary |
| ECAD Model: |
Specifications
Detailed Description
Enhance high-speed connectivity with our QSFP-DD Assembly, featuring a stacked 2x1 configuration and closed top design. Crafted for optimal performance, this assembly boasts a durable black housing and complies with RoHS standards. With 152 contacts in a 2-row layout, it ensures efficient data transmission. The through-hole termination method with compliant pins guarantees secure attachment to your board. Operating at a low amperage of 0.5A, it offers reliable power delivery. Its right-angle orientation and PCB retention feature make it easy to install. Gold-plated contact mating areas and tin-plated terminations ensure excellent conductivity. Whether for module-to-board connections or other applications, this assembly is a dependable choice in high-speed connectivity solutions.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 12/30/2022 | 512622 - Packaging Method/QTY changing. This notification is to inform you about Molex will remove inner box and PE Endcap foam.it is only package improvement, SPQ&MOQ are same ,no any change to product dimension, function and fit. | Download | |||

