26-60-6060

KK 396 Solid Vertical Header, Friction Lock, with Snap-in Plastic Peg PCB Lock, 6 Circuits, Tin (Sn) Plating

Availability
Immediate Shipment: NA
Stock Location: In Stock
Factory Stock: Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple: NA/NA
Pricing
CALL: 800.400.7041
Product Category:
Manufacturer: Molex
Manufacturer Part Number: 26-60-6060
Series: 42891 - KK 396
Amperage: 7 A
Connector Type: KK 396
Number of Contacts: 6
Number of Rows: 1
Termination Method: Through Hole
Contact Material: Brass
Body Orientation: Straight
Pitch: 3.96 mm
Voltage: 250 V
Orientation: Vertical
Tail Length: 3.56 mm
Packaging: Bag
Contact Mating Area Plating: Tin
Contact Mating Area Plating Thickness: 5.08 µm
Number of Contacts Loaded: 6
Mating Cycles: 25
PCB Locator: Yes
PCB Retention: Yes
Polarized to PCB: Yes
Contact Termination Plating Thickness: 5.08 µm
Polarized to Mate: No
PCB Thickness (Recommended): 1.6 mm
Connector System: Wire to Board
UL Agency Certification: E29179
Contact Termination Plating: Tin
Maximum Solder Process Temperature: 235 °C
Lead Free Process Capability: WAVE
Duration at Max. Process Temperature (seconds): 005
Max. Cycles at Max. Process Temperature: 001
Glow Wire Capable: No
Lock to Mating Part: Yes
Stackable: Yes
Breakaway: No
Shroud Type: No
Material Flammability Standard: 94V-0
Part Aliases: 0026606060;42891-0006
SKU: MOL26-60-6060

Environmental Initiative Details

Environmental Initiative: RoHS
Compliant: Unknown
Date of this Information: Unknown
Notes:

Product Change Notice

Effective Date Description of Change Download
12/31/2022 512847 - Change Supplier. This notification is to inform you about addition of new Supplier or Sub Supplier impacting the part(s) as
per attached list. No changes will be made to product as part of this change
Download
02/28/2022 511543 - Packaging Method/Quantity Changing. proposed packaging method is bulk packaging with air inflated bags there will be a change in DU & MLQ qty
this packaging change is done to improve the packaging quality and to effectively protect the products during transit. new packaging concept was validated with drop test at 80cm drop height there are no product/process change for the listed parts.
Download
11/12/2021 510732 - Capacity change or tool replacement. new capacity mold and assembly machine is getting added. wafers will be supplied from any of 1 existing mold or 1 new mold after the implementation date. headers will be supplied from any 4 existing machines or 1 new machine after the implementation date.
Download
03/01/2021 509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function) Download
03/15/2019 506830 - Packaging Method/Quantity Changing. The part(s) referenced in this notice will undergo packaging specification changes that may include new container sizes, quantities or changes to the label.
Download
01/01/2018 503290 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice are being moved to a different production or shipping location. No changes will be made to the product as a result of this move. Download
07/01/2017 502658 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different location. No changes will be made to the product as a result of this move. Download