| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 30700-1244 |
| Color: | Gray |
| Series: | 30700 - H-DAC 64 |
| Amperage: | 7 A |
| Connector Type: | H-DAC 64 |
| Gender: | Receptacle |
| Number of Contacts: | 24 |
| Number of Rows: | 2 |
| Pitch: | 2.54 mm, 3.5 mm |
| Material: | High Temperature Thermoplastic |
| Polarization: | A |
| Packaging: | Bag |
| Operating Temperature Range: | -40 - 100 °C |
| Circuit Application: | Power |
| Polarized to Mate: | Yes |
| Connector System: | Wire to Board, Wire to Wire |
| Glow Wire Capable: | No |
| Lock to Mating Part: | Yes |
| Stackable: | No |
| Part Aliases: | 0307001244 |
| SKU: | MOL30700-1244 |
30700-1244
Specifications
Detailed Description
Enhance your power connections with our H-DAC 64 Series Receptacle in a sleek gray hue. Crafted with durability in mind, it features 24 contacts arranged in two rows, ensuring efficient power transfer. With a pitch of 2.54mm and 3.5mm, it offers versatile compatibility for wire-to-wire or wire-to-board setups. The high-temperature thermoplastic construction guarantees reliability in even the most demanding environments, with an operating temperature range of -40 to 100°C. Each connector is polarized for secure mating, and with a locking mechanism in place, you can trust in its stability. RoHS compliant and meticulously designed, this receptacle is ideal for a range of applications in electronics and beyond. Elevate your connectivity with this essential component.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 12/24/2022 | 512047 - Equipment Transfer, Production Transfer or Rearrangement. This notification is to inform you about an equipment transfer that has been used to manufacture impacted part(s). Equipment has been moved to different site/ location/ premises. No changes will be made to product as part of this change. | Download | |||
| 08/17/2022 | 512449 - Retraction of PCN 510937. retraction is due to the project not moving forward at this time, the compounding location for SPS/PA66 grade material will not be moving from the current sub-supplier. if it is deemed that this project will again move forward at a later date a new PCN will be created & sent to impacted customers. | Download | |||
| 07/29/2022 | 510937 - Change Supplier. in efforts to mitigate the supply risk of resin material our current supplier for SPS/PA66 grade of material will be transitioning to a new Sub-Supplier fir compounding. | Download | |||
| 07/12/2022 | 512278 - Retraction of PCN 510384. Due to global material constraints & delays on getting this material to move. | Download | |||
| 08/16/2021 | 510384 - Supplier Change. Due to mfg constraints at the Florence Kentucky Location of one of our resin suppliers it has been determined to move the Mfg of one of the resin product families to Evansville Indiana location of that same supplier. | Download | |||
| 12/18/2015 | GCM 10723266 - New, Modified, Or Replacement Tooling. | Download | |||
| 08/01/2014 | GCM 10627818 - Supplier Change. | Download | |||
| 05/22/2014 | GCM 10632645 - New, Modified, Or Replacement Tooling. Molex is creating two new molds to increase our capacity to make HDAC assemblies at our Lincoln NE location. One mold will make 30700 24 circuit housings and the other mold will make 30968 24 circuit housings. | Download | |||

